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  3. Bonding Wire
  4. Bonding wire for semiconductors Ag alloy wire (Ag purity ≧99%) GX series (Nippon Steel Chemical & Materials Co., Ltd.)
Bonding wire for semiconductors Ag alloy wire (Ag purity ≧99%) GX series-Bonding wire GX2
Bonding wire for semiconductors Ag alloy wire (Ag purity ≧99%) GX series-Nippon Steel Chemical & Materials Co., Ltd.

Bonding wire for semiconductors Ag alloy wire (Ag purity ≧99%) GX series
Nippon Steel Chemical & Materials Co., Ltd.

About This Product

Nippon Steel Micrometal Co., Ltd. provides high-performance bonding wires for semiconductor packaging by making full use of its know-how in controlling material properties using trace additive elements and controlling crystal grains in metal structures during manufacturing processes, which it has cultivated through the development of steel materials. Masu. Since the invention of transistors, gold wire has been used as the mainstream connection material, but by coating copper wire with palladium, we overcame the oxidation problem and succeeded in commercializing it as the world's first EX series in 2009. It has now become the de facto standard. Electrodes that are as hard as gold wire and are less susceptible to damage.

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    Bonding wire for semiconductors Ag alloy wire (Ag purity ≧99%) GX series

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1 Models of Bonding wire for semiconductors Ag alloy wire (Ag purity ≧99%) GX series

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Bonding wire for semiconductors Ag alloy wire (Ag purity ≧99%) GX series-Part Number-Bonding wire GX2

Bonding wire GX2

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Nippon Steel Chemical & Materials Co., Ltd.

  • Japan

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