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  4. Bonding wire for semiconductors Cu wire EX series (Nippon Steel Chemical & Materials Co., Ltd.)
Bonding wire for semiconductors Cu wire EX series-Bonding wire EX1
Bonding wire for semiconductors Cu wire EX series-Nippon Steel Chemical & Materials Co., Ltd.

Bonding wire for semiconductors Cu wire EX series
Nippon Steel Chemical & Materials Co., Ltd.

About This Product

Nippon Steel Micrometal Co., Ltd. provides high-performance bonding wires for semiconductor packaging by making full use of its know-how in controlling material properties using trace additive elements and controlling crystal grains in metal structures during manufacturing processes, which it has cultivated through the development of steel materials. Masu. Since the invention of transistors, gold wire has been used as the mainstream connection material, but by coating copper wire with palladium, we overcame the oxidation problem and succeeded in commercializing it as the world's first EX series in 2009. It has now become the de facto standard. The surface of the Cu wire is coated with palladium, making it suitable for long spans and fine pitches.

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    Bonding wire for semiconductors Cu wire EX series

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1 Models of Bonding wire for semiconductors Cu wire EX series

Image Part Number Price (excluding tax) Purity Bonding reliability High humidity environment (Grade 1) Bonding reliability High humidity environment Winding length Floor life Pd distribution in FAB 2nd zygosity
Bonding wire for semiconductors Cu wire EX series-Part Number-Bonding wire EX1

Bonding wire EX1

Available upon quote

4N

Fair

Fair

~5,000m

30 days

Fair

Good

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Nippon Steel Chemical & Materials Co., Ltd.

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