Circuit board material: Adhesive-free polyimide copper-clad laminate Espanex®M series (low stiffness type)-EspanexⓇM series (low stiffness type)

Circuit board material: Adhesive-free polyimide copper-clad laminate Espanex®M series (low stiffness type)
Nippon Steel Chemical & Materials Co., Ltd.

About This Product

In 1989, we succeeded in commercializing two-layer FCCL (adhesive-free copper clad laminate) for the first time in the world. This is our main product for high-performance flexible printed wiring boards and currently boasts the world's top share. By taking advantage of the properties of polyimide resin created by our unique design and synthesis technology, we are able to support applications that require flexibility, such as high flexibility and fine circuit formation, as well as bending and mounting into narrow housings.

This adhesive-free copper clad laminate is uniquely designed by our company for applications that require particular flexibility, such as folding and mounting into narrow frameworks.

■Technology・Design and synthesis technology for highly flexible unique polyimide
・Stiffness (repulsion force) evaluation technology

■Features・More flexibility than Espanex M series
・Equivalent electrical reliability and chemical resistance to Espanex M series
・High dimensional stability equivalent to Espanex M series

■Application example・Smartphone use
・Optical pickup application
・Small LCD application

Model
There is 1 model available for this product.

Product
Circuit board material: Adhesive-free polyimide copper-clad laminate Espanex®M series (low stiffness type)

Handling Company
Nippon Steel Chemical & Materials Co., Ltd.

Categories

Polymeric Materials

Polyimide Film

Metallic Materials

Copper Clad Laminates

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1 Models of Circuit board material: Adhesive-free polyimide copper-clad laminate Espanex®M series (low stiffness type)

Image	Part Number	Price (excluding tax)
	EspanexⓇM series (low stiffness type)	Available upon quote

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About Company Handling This Product

Nippon Steel Chemical & Materials Co., Ltd.

Japan

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Circuit board material: Adhesive-free polyimide copper-clad laminate Espanex®M series (low stiffness type) Nippon Steel Chemical & Materials Co., Ltd.

About This Product

■Technology

■Features

■Application example

1 Models of Circuit board material: Adhesive-free polyimide copper-clad laminate Espanex®M series (low stiffness type)

EspanexⓇM series (low stiffness type)

Customers who viewed this product also viewed

Other products of Nippon Steel Chemical & Materials Co., Ltd.

About Company Handling This Product

Related search keywords

Circuit board material: Adhesive-free polyimide copper-clad laminate Espanex®M series (low stiffness type)
Nippon Steel Chemical & Materials Co., Ltd.