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  2. Metallic Materials
  3. Copper Clad Laminates
  4. Circuit board material Non-adhesive polyimide copper clad laminate EspanexⓇM series (Nippon Steel Chemical & Materials Co., Ltd.)
Circuit board material Non-adhesive polyimide copper clad laminate EspanexⓇM series-EspanexⓇM series
Circuit board material Non-adhesive polyimide copper clad laminate EspanexⓇM series-Nippon Steel Chemical & Materials Co., Ltd.

Circuit board material Non-adhesive polyimide copper clad laminate EspanexⓇM series
Nippon Steel Chemical & Materials Co., Ltd.

About This Product

In 1989, we succeeded in commercializing two-layer FCCL (adhesive-free copper clad laminate) for the first time in the world. This is our main product for high-performance flexible printed wiring boards and currently boasts the world's top share. By taking advantage of the properties of polyimide resin created by our unique design and synthesis technology, we are able to support applications that require flexibility, such as high flexibility and fine circuit formation, as well as bending and mounting into narrow housings. This is a high-performance adhesive-free copper-clad laminate using polyimide created by our unique design and synthesis technology.

■Technology

・Original polyimide design and synthesis technology ・Evaluation technology for various bending characteristics

■Features

・Can be combined with copper foil, which has excellent bending resistance. ・Thin polyimide can also be selected ・Detailed technical support from a team specializing in bending applications

■Application example

・Smartphone use ・Optical pickup application ・Small LCD application

  • Product

    Circuit board material Non-adhesive polyimide copper clad laminate EspanexⓇM series

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1 Models of Circuit board material Non-adhesive polyimide copper clad laminate EspanexⓇM series

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Circuit board material Non-adhesive polyimide copper clad laminate EspanexⓇM series-Part Number-EspanexⓇM series

EspanexⓇM series

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Nippon Steel Chemical & Materials Co., Ltd.

  • Japan

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