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  4. Advanced Reflow with excellent heat resistance and solderability STAR with low insertion force (DOWA Metal Tech Co., Ltd.)

Advanced Reflow with excellent heat resistance and solderability STAR with low insertion force
DOWA Metal Tech Co., Ltd.

About This Product

Advanced Reflow has superior heat resistance compared to conventional Sn plating due to its barrier structure. Furthermore, it has excellent solderability and whisker resistance, making it suitable as a Pb-free plating. If it is necessary to reduce the connector insertion force, we also offer a thin Sn type STAR (Super Thin Advanced Reflow) that has both excellent heat resistance and low insertion force. Local supply is also possible from Wieland Corporation of the United States and Dowa Metal Materials (Nantong).

■Applications

・Small terminal for automotive use ・Terminals for connectors, etc.

  • Product

    Advanced Reflow with excellent heat resistance and solderability STAR with low insertion force

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1 Models of Advanced Reflow with excellent heat resistance and solderability STAR with low insertion force

Image Part Number Price (excluding tax) Material thickness that can be processed (mm) Plate width Material processing possible plate thickness (mm) Plate thickness Type Plating thickness (μm) Base (barrier) Plating thickness (μm) Sn

Advanced Reflow/STAR

Available upon quote

Pre-plated material: 225 Max.

Pre-plated material: 0.15-1.2

Reflow Sn
Advanced Reflow
STAR

Advanced Reflow:0.2-1.2
STAR:0.2-1.2

Advanced Reflow:1.0-2.0
STAR:0.5-1.0

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About Company Handling This Product

DOWA Metal Tech Co., Ltd.

  • Japan

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