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  4. Semiconductor/MEMS packaging MCM (Multi Chip Module: non-lead glass epoxy substrate) (Ars Co., Ltd.)

Semiconductor/MEMS packaging MCM (Multi Chip Module: non-lead glass epoxy substrate)
Ars Co., Ltd.

About This Product

Creating the future with packaging production technology

■We are not only a contract production base for semiconductor/MEMS packages, but also a technology leader, striving to design cutting-edge products.

・Custom-designed IC packages (DFN, QFN, LGA, BGA) such as ultra-small non-lead type according to customer requests ・General-purpose packages such as SOT and SOP ・Transparent resin package for light emitting/receiving elements ・Hollow/partially exposed package for MEMS/sensors ・MCM (Multi-chip module) package ・Package using fine ceramic ・Compound semiconductor assembly (Sic/Gan) ・Power system custom module ・High reliability Wettable flank non-lead package for automotive applications We work together with our customers in good faith, from process design to equipment and material selection, prototyping, mass production, and quality maintenance. As an OSAT company, we are constantly pursuing and challenging technology to create new packages that achieve a high level of uncompromising quality and cost performance in response to our customers' new development needs.

  • Product

    Semiconductor/MEMS packaging MCM (Multi Chip Module: non-lead glass epoxy substrate)

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1 Models of Semiconductor/MEMS packaging MCM (Multi Chip Module: non-lead glass epoxy substrate)

Image Part Number Price (excluding tax) Substrate (lead frame) Pin Package size (mm) Max.chip size (mm) Lead pitch (mm)

MCM

Available upon quote

Glass epoxy

20

4.30×4.60×t0.80

1.40×1.90×t0.20

0.6

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Ars Co., Ltd.

  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Ars Co., Ltd.
Ars Co., Ltd.

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