Ni electroforming transfer lead)
Ars Co., Ltd.

About This Product

Creating the future with packaging production technology

■We are not only a contract production base for semiconductor/MEMS packages, but also a technology leader, striving to design cutting-edge products.・Custom-designed IC packages (DFN, QFN, LGA, BGA) such as ultra-small non-lead type according to customer requests
・General-purpose packages such as SOT and SOP
・Transparent resin package for light emitting/receiving elements
・Hollow/partially exposed package for MEMS/sensors
・MCM (Multi-chip module) package
・Package using fine ceramic
・Compound semiconductor assembly (Sic/Gan)
・Power system custom module
・High reliability Wettable flank non-lead package for automotive applications

We work together with our customers in good faith, from process design to equipment and material selection, prototyping, mass production, and quality maintenance. As an OSAT company, we are constantly pursuing and challenging technology to create new packages that achieve a high level of uncompromising quality and cost performance in response to our customers' new development needs.

Model
There are 1 models for this product.

Product
Semiconductor/MEMS packaging USB-B (Ultra Small Board: Non-lead/Ni electroforming transfer lead)

Handling Company
Ars Co., Ltd.

Categories

Semiconductor Manufacturing

Semiconductor Manufacturing Equipment Component & Part Machining

Semiconductor Manufacturing

Microelectronics & Semiconductor Packages

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1 Models of Semiconductor/MEMS packaging USB-B (Ultra Small Board: Non-lead/Ni electroforming transfer lead)

Image	Part Number	Price (excluding tax)	Substrate (lead frame)	Pin	Package size (mm)	Max.chip size (mm)	Lead pitch (mm)
	USB-B	Available upon quote	(Ni) electro-forming	3	1.20×1.20×t0.60	0.54×0.84×t0.20	0.6

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About Company Handling This Product

Ars Co., Ltd.

Japan

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Semiconductor/MEMS packaging USB-B (Ultra Small Board: Non-lead/Ni electroforming transfer lead) Ars Co., Ltd.

About This Product

■We are not only a contract production base for semiconductor/MEMS packages, but also a technology leader, striving to design cutting-edge products.

1 Models of Semiconductor/MEMS packaging USB-B (Ultra Small Board: Non-lead/Ni electroforming transfer lead)

USB-B

Customers who viewed this product also viewed

Other products of Ars Co., Ltd.

About Company Handling This Product

Related search keywords

Semiconductor/MEMS packaging USB-B (Ultra Small Board: Non-lead/Ni electroforming transfer lead)
Ars Co., Ltd.