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  4. Powder glass for low temperature sealing Aluminum nitride, Mullite, Silicon (Nippon Electric Glass Co., Ltd.)
Powder glass for low temperature sealing Aluminum nitride, Mullite, Silicon-LS-3051S
Powder glass for low temperature sealing Aluminum nitride, Mullite, Silicon-Nippon Electric Glass Co., Ltd.

Powder glass for low temperature sealing Aluminum nitride, Mullite, Silicon
Nippon Electric Glass Co., Ltd.

Nippon Electric Glass Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

27.0hours

Relatively Fast Response

About This Product

Sealing glass is a blend of low softening point glass powder and special ceramic powder. By changing the combination and blending ratio of glass powder and ceramic powder, various sealing temperatures and coefficients of thermal expansion can be accommodated. LS-2010 is widely used for DIP and QFP made of alumina (expansion coefficient approximately 70×10-7/K). In addition, the LS-1401S, which has a sealing temperature of 380°C, is used for SMD packages for crystal resonators, where low-temperature sealing is particularly preferred. LS-3051S is used for low expansion ceramics such as aluminum nitride (expansion coefficient approximately 45 x 10-7/K). LS-1301 and BF-0901 are used for silicon (expansion coefficient approximately 35×10-7/K). Usage example

■Printing and drying (excluding LS-1401S)

Add the vehicle to the powdered glass and mix thoroughly to make a paste. A suitable vehicle is one in which 5% of a low molecular weight acrylic resin is dissolved in terpineol. The printing screen is made of stainless steel (80-100 mesh) and dried at 120℃ for 10-20 minutes. Repeat printing and drying until the desired coating thickness is achieved.

■Preliminary firing

Calcination is performed in air or oxygen in order to remove the resin in the coating film. The decomposition and combustion of acrylic resin is most active between 320 and 380 degrees Celsius, so the temperature increase rate should be slow in this temperature range. Hold at peak temperature for approximately 10 minutes. In the case of a heater block, the block surface temperature is set 30 to 50°C higher than the fixing temperature, and the holding time is appropriately 1 to 2 minutes.

■Lead fixation

Perform in air and hold at fixation temperature for 5-7 minutes.

■Sealing

Perform in air or nitrogen and hold at sealing temperature for about 10 minutes.

  • Product

    Powder glass for low temperature sealing Aluminum nitride, Mullite, Silicon

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1 Models of Powder glass for low temperature sealing Aluminum nitride, Mullite, Silicon

Image Part Number Price (excluding tax) Transition point (℃) Softening point (℃) Dielectric constant 1MHz,25℃ Tone Acid resistance 20%H2SO4,70℃,1min Acid resistance 10%HNO3, 20℃, 10min Acid resistance 10%HCl, 20℃, 10min Acid resistance 10%H2SO4,20℃,10min Composition system Thermal expansion coefficient 30~250℃ (×10-7/K) Thermal conductivity (W/m・K) Specific heat (×10^3J/kg・K) Sealing temperature (℃) Density (×10^3kg/m3) Volume resistivity Log p 150℃ (Ω・cm) Tan δ 1MHz,25℃ (×10-4)
Powder glass for low temperature sealing Aluminum nitride, Mullite, Silicon-Part Number-LS-3051S

LS-3051S

Available upon quote

303

390

16

Black

1.1mg/cm2

120mg/cm2

2.7mg/cm2

0.9mg/cm2

PbO・B2O3 (composite system)

51

1.24

0.38

430

5.95

12.7

41

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About Company Handling This Product

Nippon Electric Glass Co., Ltd.

Response Rate

100.0%

Response Time

27.0hrs

Company Overview

Nippon Electric Glass Co., Ltd. (NEG) is a glass technology products manufacturer originally founded in 1949 a...

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