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SiC wafer finish grinding wheel “Nanomate Premium”-SiC wafer finishing grinding wheel Nanomate Premium
SiC wafer finish grinding wheel “Nanomate Premium”-A.L.M.T. Corp.

SiC wafer finish grinding wheel “Nanomate Premium”
A.L.M.T. Corp.

A.L.M.T. Corp.'s Response Status

Response Rate

100.0%

Response Time

12.6hours

Relatively Fast Response


About This Product

■Product overview

Achieves high efficiency and high quality processing of SiC wafers. By combining diamond abrasive grains and vitrified bond in an appropriate ratio, we were able to maintain the strength and maintain the necessary abrasive grain spacing to bite into the workpiece. It enables continuous processing of single crystal SiC, which was not possible with conventional wheels. In particular, wheels using ultra-fine grains can be processed at the same feed speed as when grinding silicon wafers, making it possible to obtain ultra-smooth machined surfaces.

■Features

・Enables continuous processing of single crystal SiC ・High-quality processing can significantly shorten CMP time in post-processing.

■Applications

Ultra-precision surface grinding of various semiconductor wafers

■Industry

Semiconductor/electronics

■Work material

semiconductor materials

■Processing method

surface grinding

  • Product

    SiC wafer finish grinding wheel “Nanomate Premium”

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1 Models of SiC wafer finish grinding wheel “Nanomate Premium”

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SiC wafer finish grinding wheel “Nanomate Premium”-Part Number-SiC wafer finishing grinding wheel Nanomate Premium

SiC wafer finishing grinding wheel Nanomate Premium

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About Company Handling This Product

Response Rate

100.0%


Response Time

12.6hrs


Company Review

5.0

Company Overview

A.L.M.T. Corp., founded in Japan in 1939, is a manufacturer of heat spreaders, tungsten/molybdenum powder and ...

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