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Silicon wafer rough grinding wheel “Nanomate V Heart”-Nanomate V heart
Silicon wafer rough grinding wheel “Nanomate V Heart”-A.L.M.T. Corp.

Silicon wafer rough grinding wheel “Nanomate V Heart”
A.L.M.T. Corp.

A.L.M.T. Corp.'s Response Status

Response Rate

100.0%

Response Time

12.6hours

Relatively Fast Response


About This Product

■Product overview

Demonstrates its power in primary grinding of as-deposited and as-sliced ​​wafers. This vitrified bond wheel has excellent abrasive grain retention, and its high porosity structure and unique abrasive layer shape achieve low grinding resistance and create new processing areas. Nanomate, which achieves a flatness of 1 μm or less on a 300 mm silicon wafer, makes it possible to process fragile materials such as semiconductors and electronic components, which was previously difficult.

■Features

・Grinding resistance is approximately 1/10 that of resin bond wheels. ・Achieves high efficiency and low load machining despite being fine grained. ・The V-shape allows you to set the optimum abrasive grain spacing to maintain good sharpness.

■Applications

Primary grinding processing of as-deposited, as-sliced ​​wafers, etc.

■Industry

Semiconductor/electronics

■Work material

・Carbide/Cermet ・Glass/ceramics

■Processing method

・Surface grinding ・Double-head surface grinding

  • Product

    Silicon wafer rough grinding wheel “Nanomate V Heart”

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1 Models of Silicon wafer rough grinding wheel “Nanomate V Heart”

Image Part Number Price (excluding tax)
Silicon wafer rough grinding wheel “Nanomate V Heart”-Part Number-Nanomate V heart

Nanomate V heart

Available upon quote

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About Company Handling This Product

Response Rate

100.0%


Response Time

12.6hrs


Company Review

5.0

Company Overview

A.L.M.T. Corp., founded in Japan in 1939, is a manufacturer of heat spreaders, tungsten/molybdenum powder and ...

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  • Japan

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