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  4. Alloy heat dissipation board Cu-W (copper-tungsten) (A.L.M.T. Corp.)
Alloy heat dissipation board Cu-W (copper-tungsten)-W-6
Alloy heat dissipation board Cu-W (copper-tungsten)-A.L.M.T. Corp.

Alloy heat dissipation board Cu-W (copper-tungsten)
A.L.M.T. Corp.

About This Product

■Product overview

This is a heat dissipation board that combines the low thermal expansion of W and the high thermal conductivity of Cu, and the coefficient of linear expansion can be varied to match the surrounding materials such as alumina and Kovar. It has excellent machinability and can manufacture products with minute and complex shapes. Allied Materials has a lineup of six types of Cu-W to meet customer needs.

■Application examples

Optical communication, wireless communication, LED substrate

■Features

W-6: Cu-W with a low coefficient of thermal expansion, close to that of GaAs and GaN, controlling thermal expansion mismatch.

  • Product

    Alloy heat dissipation board Cu-W (copper-tungsten)

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1 Models of Alloy heat dissipation board Cu-W (copper-tungsten)

Image Part Number Price (excluding tax) Composition Thermal conductivity R.T. (W/ (m・K) ) Material Average linear expansion coefficient (ppm/K)
Alloy heat dissipation board Cu-W (copper-tungsten)-Part Number-W-6

W-6

Available upon quote

94W-6Cu

141

Cu-W

R.T.~800℃：6.4

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About Company Handling This Product

A.L.M.T. Corp.

Company Overview

A.L.M.T. Corp., founded in Japan in 1939, is a manufacturer of heat spreaders, tungsten/molybdenum powder and ...

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  • Japan

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