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  4. Low temperature curing conductive adhesive Muromak Bond H-220 (MUROMACHI CHEMICALS INC)

Low temperature curing conductive adhesive Muromak Bond H-220
MUROMACHI CHEMICALS INC

About This Product

A two-component type conductive adhesive. It is used for die bonding applications such as IC chips, and can be cured from 50℃, so it can be used for materials that cannot withstand high temperatures.

■Features

・Two-component conductive adhesive that can be cured at 50℃ ・Since it cures at low temperatures, it can be used for adhesion to materials and parts with low heat resistance.

■Applications

LED, IC chip die bonding, crystal resonator adhesion, etc.

  • Product

    Low temperature curing conductive adhesive Muromak Bond H-220

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1 Models of Low temperature curing conductive adhesive Muromak Bond H-220

Image Part Number Price (excluding tax) Linear expansion coefficient (1/K) Viscosity (Pa・s) (25℃) Curing conditions Mixing ratio Elastic modulus (MPa) Tensile shear adhesive strength (N/mm2) 70℃×60 minutes Tensile shear adhesive strength (N/mm2) 50℃×120 minutes Volume resistivity (Ω・cm) 70℃×60 minutes Volume resistivity (Ω・cm) 50℃×120 minutes Pot life Durometer hardness (Type D) Glass transition temperature Tg (℃)

H-220

Available upon quote

96×10^-6

17 (base ingredient only) / 44 (after mixing)

50℃ x 120 minutes / 70℃ x 60 minutes

200:7

5,730

13.6

10.7

6.4×10^-4

7.6×10^-4

Half an hour

86

44

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About Company Handling This Product

MUROMACHI CHEMICALS INC

Company Overview

Muromachi Chemicals Inc., founded in 1917 and headquartered in Fukuoka, Japan, is a manufacturer and supplier ...

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  • Japan

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Conductive Paints
Conductive Paints　MUROMACHI CHEMICALS INC
MUROMACHI CHEMICALS INC

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