All Categories

History

  1. Metoree
  2. Semiconductor Manufacturing
  3. Wire Bonders
  4. Semi-auto wedge bonder for thick wire HB30 (TPT Japan Co., Ltd.)
Semi-auto wedge bonder for thick wire HB30-HB30
Semi-auto wedge bonder for thick wire HB30-TPT Japan Co., Ltd.

Semi-auto wedge bonder for thick wire HB30
TPT Japan Co., Ltd.

TPT Japan Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

47.2hours

About This Product

■Desktop wedge bonder for thick wires

・Compact and highly functional tabletop thick wire wedge bonder ・Loop shape control ・Easy operation with touch panel

■Included functions

・Wedge bond for thick wire ・Loop control (Z/Y axis motor control) ・Deep access・Long reach ・Vertical movable bond head ・6.5 inch touch panel ・Bond loop profile 100 memory HB30 is a desktop wedge bonder for thick wires for power modules that is newly launched as a machine exclusively for thick wires and is compact, low-priced, and has excellent operability. This is a wedge bonder for thick wires that can be used in prototype development scenes with light footwork and excellent operability that can only be achieved with a tabletop machine, such as a loop shape control function using Z/Y axis motor control and a touch panel user interface.

  • Product

    Semi-auto wedge bonder for thick wire HB30

Share this product


50+ people viewing

Free
Get started with our free quotation service - no cost, no obligation.

No Phone Required
We respect your privacy. You can receive quotes without sharing your phone number.

1 Models of Semi-auto wedge bonder for thick wire HB30

Image Part Number Price (excluding tax) Power supply Ultrasonic power Ultrasound system Recording media Equipment weight Equipment dimensions Load Lighting mechanism Compatible wire copper wire Compatible wire Aluminum wire Compatible wire Aluminum ribbon wire Storage capacity Wire cutting method Wire spool format Loop settings Ribbon bond Motor control axis Mouse ratio Bond time Bond area X-Y table Bond arm Stitch bond Control panel Wedge bond Wedge tool Z-axis motor control operating range Y-axis motor control operating range Standard
Semi-auto wedge bonder for thick wire HB30-Part Number-HB30

HB30

Available upon quote

100~240V±10%
50/60Hz
Max 10A

0~50W

PLL control
transducer

USB memory

50kg

W700×D650×H570mm

0.05~1.8kgf

Fiber optic lighting
(2 systems)

Φ100μm~φ500μm

Φ100μm~φ500μm

T200μm×W1,500μm

100 programs

Front cut

4inch wire spool

Loop profile function

Maximum 200×1,500μm

Y&Z axis

Ratio3:1

0~10sec

20×20mm

103mm

Possible

6.5”TFT touch panel

Φ100~500μm

Diameter 3.17mm x length 51mm

20mm

17mm

C.E.

Customers who viewed this product also viewed

Reviews shown here are reviews of companies.

Semi-auto wire bonder HB16-TPT Japan Co., Ltd.

Semi-auto wire bonder HB16

TPT Japan Co., Ltd.

60+ people viewing

Response time: 47.24 hours

Wire Bonders
Manual wire bonder HB10-TPT Japan Co., Ltd.

Manual wire bonder HB10

TPT Japan Co., Ltd.

60+ people viewing

Last viewed: 5 hours ago

Response time: 47.24 hours

Wire Bonders
Full manual wire Honda HB05-TPT Japan Co., Ltd.

Full manual wire Honda HB05

TPT Japan Co., Ltd.

60+ people viewing

Response time: 47.24 hours

Wire Bonders
High-speed bump bonder for wide areas for wafers SBB-5200-Yamaha Robotics Holdings Co., Ltd.

High-speed bump bonder for wide areas for wafers SBB-5200

Yamaha Robotics Holdings Co., Ltd.

60+ people viewing

Last viewed: 16 hours ago

Response time: 43.84 hours

Wire Bonders

2 models listed

Tabletop Daihonda HB75-TPT Japan Co., Ltd.

Tabletop Daihonda HB75

TPT Japan Co., Ltd.

40+ people viewing

Response time: 47.24 hours

Wire Bonders
Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE-HiSOL,Inc.

Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE

HiSOL,Inc.

120+ people viewing

Last viewed: 44 minutes ago

Response time: 40.54 hours

Wire Bonders

3 models listed

High-speed Cu wire bonder UTC-5000NeoCu Super-Yamaha Robotics Holdings Co., Ltd.

High-speed Cu wire bonder UTC-5000NeoCu Super

Yamaha Robotics Holdings Co., Ltd.

70+ people viewing

Last viewed: 58 minutes ago

Response time: 43.84 hours

Wire Bonders

2 models listed

Desktop manual wedge bonder E series-HiSOL,Inc.

Desktop manual wedge bonder E series

HiSOL,Inc.

100+ people viewing

Last viewed: 9 hours ago

Response time: 40.54 hours

Wire Bonders
High-speed Au wire bonder UTC-5000Super-Yamaha Robotics Holdings Co., Ltd.

High-speed Au wire bonder UTC-5000Super

Yamaha Robotics Holdings Co., Ltd.

80+ people viewing

Last viewed: 59 minutes ago

Response time: 43.84 hours

Wire Bonders

2 models listed

Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)-HiSOL,Inc.

Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)

HiSOL,Inc.

120+ people viewing

Response time: 40.54 hours

Wire Bonders
High-speed Cu wire bonder for wide frame UTC-5000WE NeoCu-Yamaha Robotics Holdings Co., Ltd.

High-speed Cu wire bonder for wide frame UTC-5000WE NeoCu

Yamaha Robotics Holdings Co., Ltd.

70+ people viewing

Last viewed: 58 minutes ago

Response time: 43.84 hours

Wire Bonders

2 models listed

High-speed Au wire bonder for LED individual semiconductors UTC-5100-Yamaha Robotics Holdings Co., Ltd.

High-speed Au wire bonder for LED individual semiconductors UTC-5100

Yamaha Robotics Holdings Co., Ltd.

70+ people viewing

Last viewed: 58 minutes ago

Response time: 43.84 hours

Wire Bonders

2 models listed

See More Wire Bonders Products

Other products of TPT Japan Co., Ltd.

Reviews shown here are reviews of companies.

Semi-auto wire bonder HB16-TPT Japan Co., Ltd.

Semi-auto wire bonder HB16

TPT Japan Co., Ltd.

60+ people viewing

Response time: 47.24 hours

Wire Bonders
Manual wire bonder HB10-TPT Japan Co., Ltd.

Manual wire bonder HB10

TPT Japan Co., Ltd.

60+ people viewing

Last viewed: 5 hours ago

Response time: 47.24 hours

Wire Bonders
Full manual wire Honda HB05-TPT Japan Co., Ltd.

Full manual wire Honda HB05

TPT Japan Co., Ltd.

60+ people viewing

Response time: 47.24 hours

Wire Bonders
Tabletop Daihonda HB75-TPT Japan Co., Ltd.

Tabletop Daihonda HB75

TPT Japan Co., Ltd.

40+ people viewing

Response time: 47.24 hours

Wire Bonders
Bonding tool capillary-TPT Japan Co., Ltd.

Bonding tool capillary

TPT Japan Co., Ltd.

40+ people viewing

Response time: 47.24 hours

Capillaries
Bonding tool wedge tool-TPT Japan Co., Ltd.

Bonding tool wedge tool

TPT Japan Co., Ltd.

60+ people viewing

Response time: 47.24 hours

Bonding Wire

View more products of TPT Japan Co., Ltd.

About Company Handling This Product

TPT Japan Co., Ltd.

Response Rate

100.0%

Response Time

47.2hrs

  • Japan

Related search keywords

Wire Bonders
Wire Bonders　TPT Japan Co., Ltd.
TPT Japan Co., Ltd.

This is the version of our website addressed to speakers of English in the United States. If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.

Copyright © 2024 Metoree