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  4. Semi-auto wire bonder HB16 (TPT Japan Co., Ltd.)
Semi-auto wire bonder HB16-HB16
Semi-auto wire bonder HB16-TPT Japan Co., Ltd.

Semi-auto wire bonder HB16
TPT Japan Co., Ltd.

TPT Japan Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

47.2hours

About This Product

■Pursuing high precision bonding and operability - Can be used for both wedge bond and ball bond, making it ideal for prototype development

・High precision bonding with loop shape control ・Excellent operability with touch panel and wire feed function

■Included functions

・Can be used as both wedge bond and ball band ・Loop control (Z/Y axis motor control) ・Deep access・Long reach ・Vertical movable bond head ・6.5 inch touch panel ・Wire feed function ・Bond loop profile 100 memory The HB16 is a semi-automatic tabletop wedge/ball wire bonder that is ideal for research and development and low-volume production in pursuit of high-precision bonding and operability. You can switch between wedge bond and ball bond by changing the tool and setting the program, so you can support a variety of future applications such as aluminum wire and gold wire. In addition, the loop shape can be freely controlled by Z/Y-axis motor control, and bonding can be performed stably, so it can be used for smaller and more complex packages such as low loops, multilayer loops, and narrow pitch bonding. The user interface uses a 6.5-inch touch panel, allowing you to change parameters and save/load smoothly. On the work surface, the sliding clamp and wire feed function greatly reduce wire handling work, making this wire bonder extremely easy to operate.

■Others

・A dedicated unit (optional) is required for copper wire/silver wire ball bonding. - Ribbon bond is also available.

  • Product

    Semi-auto wire bonder HB16

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1 Models of Semi-auto wire bonder HB16

Image Part Number Price (excluding tax) Ultrasonic power Ultrasound system Recording media Load Corresponding deep hitting distance Compatible wire copper wire/silver wire Compatible wire Gold wire Compatible wire Aluminum wire Storage capacity Wire cutting method Wire feed angle Wire spool format Wire clamp Loop settings Ribbon bond Motor control axis Mouse ratio Ball bond Ball bump Ball size control Bond time Bond area X-Y table Bond arm Heat stage Control panel Capillary Wedge bond Wedge tool Z-axis motor control operating range Y-axis motor control operating range
Semi-auto wire bonder HB16-Part Number-HB16

HB16

Available upon quote

0~2,000mW

PLL control 62kHz
transducer

USB memory

15~150gf

16mm

Ball bond φ20μm~φ50μm
Wedge bond φ20μm~φ75μm

Ball bond/stud bump φ17μm~φ50μm
Wedge bond φ17μm~φ75μm

Wedge bond φ17μm~φ75μm

100 programs

Clamp&table tear

90° deep hit

Motor control 2inch
wire spool

Motor control

Loop profile function

Maximum 25×250μm

Y&Z axis

Ratio6:1

Φ17~50μm

Φ17~50μm

Digital pole size control

0~10,000msec

10×10mm
(Maximum 20×20mm)

165mm

250℃ MAX

6.5”TFT touch panel

Diameter 1.58mm x length 11mm

Φ17~75μm

Diameter 1.58mm x length 19mm

17mm

10mm

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About Company Handling This Product

TPT Japan Co., Ltd.

Response Rate

100.0%

Response Time

47.2hrs

  • Japan

Related search keywords

Wire Bonders
Wire Bonders　TPT Japan Co., Ltd.
TPT Japan Co., Ltd.

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