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Semiconductor manufacturing equipment Low-temperature film deposition Compatible with flexible substrates Glass substrate film deposition equipment-Glass substrate film deposition equipment
Semiconductor manufacturing equipment Low-temperature film deposition Compatible with flexible substrates Glass substrate film deposition equipment-M.WATANABE & CO.,LTD.

Semiconductor manufacturing equipment Low-temperature film deposition Compatible with flexible substrates Glass substrate film deposition equipment
M.WATANABE & CO.,LTD.

M.WATANABE & CO.,LTD.'s Response Status

Response Rate

100.0%

Response Time

60.5hours


About This Product

This is a 4.5 generation glass substrate deposition system compatible with rigid/flexible devices such as FPDs.

■Basic information

Equipped with two gas heads with an effective film-forming width of 760 mm and an adsorption heating stage, temperature controllability within ±3% has been achieved. It is possible to form a 100nm SiO2 film on a 4.5 generation glass substrate at 250°C with a throughput of 25 sheets/h or more, ensuring film thickness uniformity within 10%.

■Features

・Low temperature (150-300℃) film formation ・Deposition of 100nm SiO2 film on 4.5 generation glass substrate at 250℃ with throughput of 25 sheets/h or more ・Simple maintenance ・Low CoO (low running cost) ・Formation of high quality SiO2 film: low stress, no plasma damage, small particles ・Reduced installation and maintenance costs: Small footprint, no vacuum or plasma treatment required

■Applications

・Insulating film for FPD (NSG) ・Oxide semiconductor TFT passivation film (NSG)

  • Product

    Semiconductor manufacturing equipment Low-temperature film deposition Compatible with flexible substrates Glass substrate film deposition equipment

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1 Models of Semiconductor manufacturing equipment Low-temperature film deposition Compatible with flexible substrates Glass substrate film deposition equipment

Image Part Number Price (excluding tax) Device size (mm) Film forming temperature Gas type
Semiconductor manufacturing equipment Low-temperature film deposition Compatible with flexible substrates Glass substrate film deposition equipment-Part Number-Glass substrate film deposition equipment

Glass substrate film deposition equipment

Available upon quote

1,300 (W) x 7350 (D) x 2,000 (H)

150~300℃

SiH4, O3/O2, PH3, B2H6

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About Company Handling This Product

Response Rate

100.0%


Response Time

60.5hrs

Company Overview

M.Watanabe Co., Ltd., founded in 1953 with headquarters in Koga City, Japan, is a manufacturer of semiconducto...

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  • Japan

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