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  4. Semiconductor manufacturing equipment High performance single wafer atmospheric pressure CVD (APCVD) equipment (A200V) (M.WATANABE & CO.,LTD.)
Semiconductor manufacturing equipment High performance single wafer atmospheric pressure CVD (APCVD) equipment (A200V)-A200V
Semiconductor manufacturing equipment High performance single wafer atmospheric pressure CVD (APCVD) equipment (A200V)-M.WATANABE & CO.,LTD.

Semiconductor manufacturing equipment High performance single wafer atmospheric pressure CVD (APCVD) equipment (A200V)
M.WATANABE & CO.,LTD.

M.WATANABE & CO.,LTD.'s Response Status

Response Rate

100.0%

Response Time

52.4hours

About This Product

Single-wafer atmospheric pressure CVD (APCVD) equipment for forming NSG (SiO2) /PSG/BPSG films for small quantities and a wide variety of products (compatible with 8-inch SiC wafers) A200V is a single-wafer atmospheric pressure CVD device (APCVD device) for forming silicon oxide films (SiO2 films) such as interlayer insulation films, passivation films (protective films), and sacrificial films.

■Basic information

The face-down film deposition method, in which the wafer is heated with the film-forming side facing down and the backside adsorbed in a closed chamber, and the process gas is blown up from the bottom to form a film, enables safe and high-performance processing with low particles. Achieved high quality film formation. With the patented wafer warp correction function, even highly warped wafers such as SiC wafers can be reliably adsorbed and excellent film thickness uniformity can be obtained. The structure reduces the adhesion of side reaction products around the wafer, improving maintainability (low load and long cycles). The compact housing size allows for adjacent installation, minimizing the footprint.

■Features

・Ideal for forming insulating films and diffusion/implantation masks ・Low particle deposition by single wafer face-down deposition ・High safety and film formation stability due to closed chamber ・Suitable for SiC wafers with wafer warp correction function (patented) ・Low load/long cycle maintenance ・Save space by installing the compact housing and mirror type next to each other ・Low CoO (low running cost)

■Applications

・Interlayer insulation film for power semiconductors (NSG/PSG/BPSG) ・Hard mask for diffusion/implantation, sacrificial film (NSG) ・Passivation film (protective film/insulating film) (NSG) ・Optical waveguide (NSG/BPSG)

■Delivery record

・Domestic and international semiconductor device manufacturers ・University/Research Institute/Research Institute

  • Product

    Semiconductor manufacturing equipment High performance single wafer atmospheric pressure CVD (APCVD) equipment (A200V)

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1 Models of Semiconductor manufacturing equipment High performance single wafer atmospheric pressure CVD (APCVD) equipment (A200V)

Image Part Number Price (excluding tax) Device size (mm) Film forming temperature Gas type
Semiconductor manufacturing equipment High performance single wafer atmospheric pressure CVD (APCVD) equipment (A200V)-Part Number-A200V

A200V

Available upon quote

890 (W) x 2,300 (D) x 2,250 (H)

350~450℃

・SiH4/O2 type (SiH4/PH3/B2H6/O2/N2)
・TEOS/O3 series (TEOS/TMOP/TEB/O3/O2/N2) (optional)

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About Company Handling This Product

M.WATANABE & CO.,LTD.

Response Rate

100.0%

Response Time

52.4hrs

Company Overview

M.Watanabe Co., Ltd., founded in 1953 with headquarters in Koga City, Japan, is a manufacturer of semiconducto...

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  • Japan

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