All Categories

History

  1. Metoree
  2. Crystal blank mask filling device PMI-30 (Yamaha Robotics Holdings Co., Ltd.)
Crystal blank mask filling device PMI-30-PMI-30
Crystal blank mask filling device PMI-30-Yamaha Robotics Holdings Co., Ltd.

Crystal blank mask filling device PMI-30
Yamaha Robotics Holdings Co., Ltd.

Yamaha Robotics Holdings Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

39.3hours

About This Product

■Summary

- This is a device that picks up crystal pieces (blanks) scattered on a tray, performs image measurement and position correction, and then transfers and inserts them into a metal mask for film formation. ・It can also be used as a device for transferring and arranging small chip components onto trays, etc.

■Features

- This is a device that image-recognizes the blanks spread on a tray, picks them up with a suction nozzle, measures the blanks by image, and then transfers and inserts them into a metal mask, etc. for film-forming after position correction. ・A total of three cameras are used to recognize the blank on the tray, correct the mask position, and correct the position of the picked up blank. Through high-precision image processing, small blanks can be processed. It is possible to transfer and insert it into the metal mask for film formation more reliably. ・Ideal for small blanks and thin blanks for 2016/1612/1210. ・It is a device with a small installation space of 1000 x 1000 (mm).

■Usage example

This device picks up crystal pieces (blanks) scattered on a tray, performs image measurement and position correction, and then transfers and inserts them into a metal mask for film formation.

■Options

・It can also be used as a device for transferring and arranging small chip components onto trays, etc. - Can be used as a device to transfer small chip parts from tray to tray with different pitches. - Crystal blanks can be transferred to cleaning pallets, etc. ・In addition to the standard cycle time of 1.5s, we can also manufacture high-speed types with a cycle time of 0.8s.

  • Product

    Crystal blank mask filling device PMI-30

Share this product


80+ people viewing

Free
Get started with our free quotation service - no cost, no obligation.

No Phone Required
We respect your privacy. You can receive quotes without sharing your phone number.

1 Models of Crystal blank mask filling device PMI-30

Image Part Number Price (excluding tax) Image position correction Insertion rate Target thickness Target work size Target work External dimensions Work storage Work supply Cycle time Option
Crystal blank mask filling device PMI-30-Part Number-PMI-30

PMI-30

Available upon quote

・Position correction of metal mask for film formation
・Blank position correction and rotation direction correction

98% or more

20μm~200μm (For thickness less than this, please contact us.)

・3.2×2.5mm
・2.5×2.0mm
・2.0×1.6mm
・1.6×1.2mm
・Crystal blank for 1.2×1.0mm *However, the standard specification has 3 types with similar dimensions.

Crystal piece (crystal blank)

W1,000×D1,000×H1,670mm (excluding protrusions such as Hepa filter and Patlite)

Metal mask for film formation (set in 10-stage magazine)

Flat tray (scattered tray)

Approximately 1.5 seconds/piece

Can be transferred to cleaning pallets, etc.

Other products of Yamaha Robotics Holdings Co., Ltd.

Reviews shown here are reviews of companies.

plunger-Yamaha Robotics Holdings Co., Ltd.

plunger

Yamaha Robotics Holdings Co., Ltd.

260+ people viewing

Response time: 39.31 hours

Plungers
Flip chip bonder YSB55w-Yamaha Robotics Holdings Co., Ltd.

Flip chip bonder YSB55w

Yamaha Robotics Holdings Co., Ltd.

140+ people viewing

Last viewed: 20 hours ago

Response time: 39.31 hours

Flip Chip Bonders
Mounting CAM system PC-7-Yamaha Robotics Holdings Co., Ltd.

Mounting CAM system PC-7

Yamaha Robotics Holdings Co., Ltd.

160+ people viewing

Last viewed: 8 hours ago

Response time: 39.31 hours

CAD/CAM Systems

3 models listed

High-speed bump bonder for wide areas for wafers SBB-5200-Yamaha Robotics Holdings Co., Ltd.

High-speed bump bonder for wide areas for wafers SBB-5200

Yamaha Robotics Holdings Co., Ltd.

150+ people viewing

Last viewed: 4 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

Ultra-high precision die bonder with advanced pickup function SPA-1000-Yamaha Robotics Holdings Co., Ltd.

Ultra-high precision die bonder with advanced pickup function SPA-1000

Yamaha Robotics Holdings Co., Ltd.

170+ people viewing

Last viewed: 4 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

High-speed, high-precision small chip die bonder STC-800-Yamaha Robotics Holdings Co., Ltd.

High-speed, high-precision small chip die bonder STC-800

Yamaha Robotics Holdings Co., Ltd.

180+ people viewing

Last viewed: 16 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

High-speed Cu wire bonder UTC-5000NeoCu Super-Yamaha Robotics Holdings Co., Ltd.

High-speed Cu wire bonder UTC-5000NeoCu Super

Yamaha Robotics Holdings Co., Ltd.

180+ people viewing

Last viewed: 59 minutes ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

High-speed Au wire bonder UTC-5000Super-Yamaha Robotics Holdings Co., Ltd.

High-speed Au wire bonder UTC-5000Super

Yamaha Robotics Holdings Co., Ltd.

230+ people viewing

Last viewed: 11 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

High-speed Cu wire bonder for wide frame UTC-5000WE NeoCu-Yamaha Robotics Holdings Co., Ltd.

High-speed Cu wire bonder for wide frame UTC-5000WE NeoCu

Yamaha Robotics Holdings Co., Ltd.

150+ people viewing

Last viewed: 12 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

High-speed Au wire bonder for LED individual semiconductors UTC-5100-Yamaha Robotics Holdings Co., Ltd.

High-speed Au wire bonder for LED individual semiconductors UTC-5100

Yamaha Robotics Holdings Co., Ltd.

170+ people viewing

Last viewed: 18 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

Large module molding equipment GTM-170T-Yamaha Robotics Holdings Co., Ltd.

Large module molding equipment GTM-170T

Yamaha Robotics Holdings Co., Ltd.

120+ people viewing

Last viewed: 13 hours ago

Response time: 39.31 hours

Molding Machinery

2 models listed

Clean curing furnace for crystal devices PRO-series PCO-series-Yamaha Robotics Holdings Co., Ltd.

Clean curing furnace for crystal devices PRO-series PCO-series

Yamaha Robotics Holdings Co., Ltd.

60+ people viewing

Last viewed: 12 hours ago

Response time: 39.31 hours


View more products of Yamaha Robotics Holdings Co., Ltd.

About Company Handling This Product

Yamaha Robotics Holdings Co., Ltd.

Response Rate

100.0%

Response Time

39.3hrs

  • Japan

This is the version of our website addressed to speakers of English in the United States. If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.

Copyright © 2025 Metoree