High-speed blank mounter for crystal blanks PBM-1100
Yamaha Robotics Holdings Co., Ltd.
About This Product
■Summary
-This is the industry's highest level equipment that applies adhesive to the SMD type crystal device package and mounts the crystal blank, achieving a takt time of 0.7 seconds.
・We also have a lineup of equipment that directly breaks off and mounts chips from crystal wafers. Obtained Japanese Patent No. 4949937
・We have made repeated improvements in pursuit of ease of use and high-precision mounting, and have established the No. 1 position in the industry since its release.
■Features
・A high-precision, high-performance mounter that can handle small packages such as 1612/1210/1008.
・This device uses a digital camera and new lighting to achieve high measurement accuracy, and uses PFA's original image processing system to perform measurements and inspections, contributing to improving product quality.
・High rigidity has been improved by using the frame, base integrated structure, and cast metal, and a takt time of 0.7 seconds/piece has been achieved.
・This device is equipped with IoT/product quality improvement/self-diagnosis functions, such as managing the usage time and number of times main parts and consumable parts are used, and the usage time and number of times adhesives are applied.
- Aggregation from measurement data is possible. In addition, it is possible to record up to 50 past image results measured by each camera, contributing to defect analysis.
■Usage example
This is an assembly device that applies adhesive to the package of an SMD type crystal device and mounts a crystal piece (blank).
■Usage example Optional support
・Double coating unit mechanism
・A mechanism that breaks off a crystal chip from a crystal wafer of 4 inches or less in size and mounts the broken off crystal chip on a package coated with adhesive. Japanese Patent No. 4949937 has been obtained.
・Function to measure the height difference between the package seal surface and the blank surface using a laser displacement meter after mounting the crystal piece (blank)
・Expansion of target varieties
・Can be connected in-line to a clean curing furnace (4 installed machines and 1 curing furnace connected, 2 installed machines and 1 curing furnace connected)
■External mold size
・Standard specifications W1400×D1400×H1700mm (excluding protrusions such as Hepa filter, monitor, and patrol light)
・With crystal wafer chip break-off mechanism W1600 x D1650 x H1700mm (excluding protrusions such as Hepa filter, monitor, patrol light, etc.)
-
Product
High-speed blank mounter for crystal blanks PBM-1100
-
Handling Company
Yamaha Robotics Holdings Co., Ltd.
-
Categories
1 Models of High-speed blank mounter for crystal blanks PBM-1100
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
|
|
PBM-1100 |
Available upon quote |
Customers who viewed this product also viewed
Other products of Yamaha Robotics Holdings Co., Ltd.
View more products of Yamaha Robotics Holdings Co., Ltd.