All Categories

History

  1. Metoree
  2. Active alignment device for dual cameras HM-A100D (Yamaha Robotics Holdings Co., Ltd.)
Active alignment device for dual cameras HM-A100D-HM-A100D
Active alignment device for dual cameras HM-A100D-Yamaha Robotics Holdings Co., Ltd.

Active alignment device for dual cameras HM-A100D
Yamaha Robotics Holdings Co., Ltd.

Yamaha Robotics Holdings Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

39.3hours

About This Product

■Summary

This device is a fully automatic device that adjusts the optical axis of a smartphone's dual camera and fixes it to a bracket.

■Features

-A device that actively aligns (6-axis adjustment) the optical axis of the sub camera module with the lens optical axis of the main camera module with bracket and assembles it. ・The main module and sub-module loading, UV resin application, 6-axis adjustment, UV irradiation, and unloading are fully automated.

■Installation dimensions

W2670xD2070xH2105 (Not included signal tower)

  • Product

    Active alignment device for dual cameras HM-A100D

Share this product


80+ people viewing

Free
Get started with our free quotation service - no cost, no obligation.

No Phone Required
We respect your privacy. You can receive quotes without sharing your phone number.

1 Models of Active alignment device for dual cameras HM-A100D

Image Part Number Price (excluding tax)
Active alignment device for dual cameras HM-A100D-Part Number-HM-A100D

HM-A100D

Available upon quote

Other products of Yamaha Robotics Holdings Co., Ltd.

Reviews shown here are reviews of companies.

plunger-Yamaha Robotics Holdings Co., Ltd.

plunger

Yamaha Robotics Holdings Co., Ltd.

230+ people viewing

Last viewed: 19 minutes ago

Response time: 39.31 hours

Plungers
Flip chip bonder YSB55w-Yamaha Robotics Holdings Co., Ltd.

Flip chip bonder YSB55w

Yamaha Robotics Holdings Co., Ltd.

110+ people viewing

Last viewed: 10 hours ago

Response time: 39.31 hours

Flip Chip Bonders
Mounting CAM system PC-7-Yamaha Robotics Holdings Co., Ltd.

Mounting CAM system PC-7

Yamaha Robotics Holdings Co., Ltd.

130+ people viewing

Last viewed: 12 hours ago

Response time: 39.31 hours

CAD/CAM Systems

3 models listed

High-speed bump bonder for wide areas for wafers SBB-5200-Yamaha Robotics Holdings Co., Ltd.

High-speed bump bonder for wide areas for wafers SBB-5200

Yamaha Robotics Holdings Co., Ltd.

120+ people viewing

Last viewed: 10 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

Ultra-high precision die bonder with advanced pickup function SPA-1000-Yamaha Robotics Holdings Co., Ltd.

Ultra-high precision die bonder with advanced pickup function SPA-1000

Yamaha Robotics Holdings Co., Ltd.

120+ people viewing

Last viewed: 10 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

High-speed, high-precision small chip die bonder STC-800-Yamaha Robotics Holdings Co., Ltd.

High-speed, high-precision small chip die bonder STC-800

Yamaha Robotics Holdings Co., Ltd.

140+ people viewing

Last viewed: 10 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

High-speed Cu wire bonder UTC-5000NeoCu Super-Yamaha Robotics Holdings Co., Ltd.

High-speed Cu wire bonder UTC-5000NeoCu Super

Yamaha Robotics Holdings Co., Ltd.

130+ people viewing

Last viewed: 5 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

High-speed Au wire bonder UTC-5000Super-Yamaha Robotics Holdings Co., Ltd.

High-speed Au wire bonder UTC-5000Super

Yamaha Robotics Holdings Co., Ltd.

170+ people viewing

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

High-speed Cu wire bonder for wide frame UTC-5000WE NeoCu-Yamaha Robotics Holdings Co., Ltd.

High-speed Cu wire bonder for wide frame UTC-5000WE NeoCu

Yamaha Robotics Holdings Co., Ltd.

120+ people viewing

Last viewed: 10 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

High-speed Au wire bonder for LED individual semiconductors UTC-5100-Yamaha Robotics Holdings Co., Ltd.

High-speed Au wire bonder for LED individual semiconductors UTC-5100

Yamaha Robotics Holdings Co., Ltd.

130+ people viewing

Last viewed: 3 hours ago

Response time: 39.31 hours

Semiconductor Manufacturing Equipment Component & Part Machining

2 models listed

Large module molding equipment GTM-170T-Yamaha Robotics Holdings Co., Ltd.

Large module molding equipment GTM-170T

Yamaha Robotics Holdings Co., Ltd.

100+ people viewing

Response time: 39.31 hours

Molding Machinery

2 models listed

Crystal blank mask filling device PMI-30-Yamaha Robotics Holdings Co., Ltd.

Crystal blank mask filling device PMI-30

Yamaha Robotics Holdings Co., Ltd.

60+ people viewing

Last viewed: 10 hours ago

Response time: 39.31 hours


View more products of Yamaha Robotics Holdings Co., Ltd.

About Company Handling This Product

Yamaha Robotics Holdings Co., Ltd.

Response Rate

100.0%

Response Time

39.3hrs

  • Japan

This is the version of our website addressed to speakers of English in the United States. If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.

Copyright © 2025 Metoree