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  2. Mold for compression molding (Yamaha Robotics Holdings Co., Ltd.)
Mold for compression molding-Mold for compression molding
Mold for compression molding-Yamaha Robotics Holdings Co., Ltd.

Mold for compression molding
Yamaha Robotics Holdings Co., Ltd.

About This Product

■Summary

In addition to transfer molding, there is also "compression molding" in resin molding. In addition to molding the wafer itself, compression molding can also be used to mold large-sized panels, strip substrates, metal carriers, glass substrates, and other advanced logic products. *For compression molding, FAME and vacuum molding are essential. Another advantage of compression molding is that it does not require a transfer mechanism, so there are no problems such as resin burrs or dust. Furthermore, since it is compression molded, the resin usage rate is 100% (zero waste), meeting the demands for reducing environmental burden.

■Features

・No transfer mechanism required ・Wafer size: MAX Φ12 inch ・Panel size: MAX 620mmx620mm ・Board size: MAX 100mmx300mm ・Resin form: liquid, granule, sheet available

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    Mold for compression molding

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1 Models of Mold for compression molding

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Mold for compression molding-Part Number-Mold for compression molding

Mold for compression molding

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Yamaha Robotics Holdings Co., Ltd.

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