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  2. Mold for transfer molding (Yamaha Robotics Holdings Co., Ltd.)
Mold for transfer molding-Mold for transfer molding
Mold for transfer molding-Yamaha Robotics Holdings Co., Ltd.

Mold for transfer molding
Yamaha Robotics Holdings Co., Ltd.

Yamaha Robotics Holdings Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

39.3hours

About This Product

■Summary

In the semiconductor assembly process, "resin molding" refers to a product in which a semiconductor chip is mounted on a substrate (lead frame, polyimide tape, etc.) and the semiconductor chip and board terminals are connected with metal wires, and is subjected to external stresses such as shock, temperature, and humidity. This refers to hardening the surrounding area with resin such as epoxy to protect it from damage. In the semiconductor industry, this hardening is called "resin molding," "resin encapsulation," or "mold forming." There are various types of "resin" required for "resin molding" depending on the molding process (construction method). In addition, different resin forms are used depending on the molding method. Transfer molding, a typical molding method, uses tablet-shaped resin, but liquid resin can also be used.

■Features

・Moldable lead frame size MAX100mmx300mm ・FAME molding possible ・Possible to perform vacuum molding ・Substrate thickness adjustment mechanism ・Movable pin mechanism ・Substrate adsorption mechanism ・H/S exposed molding mechanism ・Liquid resin can be used

  • Product

    Mold for transfer molding

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1 Models of Mold for transfer molding

Image Part Number Price (excluding tax)
Mold for transfer molding-Part Number-Mold for transfer molding

Mold for transfer molding

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About Company Handling This Product

Yamaha Robotics Holdings Co., Ltd.

Response Rate

100.0%

Response Time

39.3hrs

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