Large module molding equipment GTM-170T
Yamaha Robotics Holdings Co., Ltd.
About This Product
■Summary
・Transfer molding equipment that can efficiently mass produce power semiconductors and large electronic devices
・Equipped with a large-sided, high-output press necessary for sealing large devices
・Supports large package products with dual inline plunger layout
・Stabilized molding quality with individual preheat stage
■Features
・Using a large capacity twin hopper, it is possible to supply mini tablets in large packages.
・Supports product takt by supporting multiple mini-tablets and high-cycle alignment (Product takt: 3.5sec with 3-press specification equipment)
・Module connection system allows you to select the number of presses according to production volume
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Product
Large module molding equipment GTM-170T
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Handling Company
Yamaha Robotics Holdings Co., Ltd.
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Categories
1 Models of Large module molding equipment GTM-170T
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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GTM-170T |
Available upon quote |
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