Compact manual molding equipment GTM-X MS
Yamaha Robotics Holdings Co., Ltd.
About This Product
■Summary
・Manual system using the same molding machine as automatic machine
・Semiconductor packages, general electronic components, automotive electronic components, etc. can be encapsulated (molded) using thermosetting resin.
・Possible to produce small quantities and a wide variety of products from prototypes.
■Features
・Can mold 100x300mmx2 frames
・60% larger molding area than conventional machine
・Products with a large amount of resin can also be molded.
・Large electronic components for automotive applications such as IGBT and ECU
・Module work can also be formed
・AC servo motor is used to drive the mold clamping and transfer parts.
・Excellent ejection performance in low speed range
・Highly accurate and stable mold clamping and resin injection possible
・No need for hydraulic oil treatment or cooling water
・Molding methods can be changed from transfer to compression, etc. by simply replacing the mold.
- Adopts a bronze touch panel, allowing for product type switching, registration, and molding data changes.
・Easy to use and operate
・Enables recording of molding data & external output function
■Optional example
・FAME mechanism
・Lower substrate suction unit
・Deaeration unit
・Chase monitor
・CDIM molding
・TCM molding
・Data collection function
・Mold replacement jig, lifter
・Heat press for sintering
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Product
Compact manual molding equipment GTM-X MS
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Handling Company
Yamaha Robotics Holdings Co., Ltd.
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Categories
1 Models of Compact manual molding equipment GTM-X MS
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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GTM-X MS |
Available upon quote |
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