High-speed Au wire bonder for LED individual semiconductors UTC-5100
Yamaha Robotics Holdings Co., Ltd.
About This Product
■Summary
High-speed wire bonder compatible with wide frames and suitable for LED and discrete production.
■Features
- Renewed X, Y, and Z motors for high-speed bonding. Platform that achieves 42ms/0.7mm (45ms/2mm)
・Achieved bonding accuracy of ±3.0μm (3σ)
・Secures a Y bonding area of 95mm, allowing frame transportation of 102mm x 300mm
・Supports simultaneous detection in X direction and Y direction
- Compatible with Cu wire by adding Cu kit (optional)
Usage example
■Capillary Wedge Bonding (CWB) connected with a thin chain
NAND flash memory is widely used as a storage medium, from USB memory to cloud servers, and is bonded by stacking many dies to increase capacity. Signals from the stacked dies are transmitted by wire-bonded metal wires. Generally, the process requires repeated bonding and wire cutting for each stage, which is a time-consuming process, and has become a bottleneck in improving productivity.
In response, Shinkawa has developed Capillary Wedge Bonding (CWB) technology, which allows multiple connections to be made at once without cutting the wires. Since this technology is expected to significantly shorten the takt time, Shinkawa is continuing to improve this technology so that it can be used by a wide range of customers.
■From “connecting” to “creating” Wire bonder as electronic component manufacturing equipment
Wire bonders are used as devices for connecting wires that transmit electrical signals, but further development is possible.
Through numerous experiences in connecting, it has become possible to manipulate wires freely, and by utilizing this, it is possible to evolve into an electronic component production device that can create coils, which are important parts of electronic components. can. For example, you can generate coils with specific constants or create supplementary coils to tune your circuit.
Shinkawa will continue to take on new challenges based on wire bonder technology.
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Product
High-speed Au wire bonder for LED individual semiconductors UTC-5100
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Handling Company
Yamaha Robotics Holdings Co., Ltd.
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Categories
1 Models of High-speed Au wire bonder for LED individual semiconductors UTC-5100
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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UTC-5100 |
Available upon quote |
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