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Response Rate
100.0%
Response Time
39.3hours
Product
High-speed Au wire bonder for LED individual semiconductors UTC-5100Handling Company
Yamaha Robotics Holdings Co., Ltd.Categories
| Image | Part Number | Price (excluding tax) | Drive source vacuum | Drive source Power consumption | Drive source Input power supply | Drive source air | Mass | Equipment dimensions | Production management | Vibration suppression method | Product name | Control resolution resolution | Work size | Wire diameter | Loader unloader | Bond load | Bonding accuracy | Bonding wire length | Number of bonding wires | Bonding speed | Bonding area |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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UTC-5100 |
Available upon quote |
-74kPa (-550mmHg) or less (gauge pressure) |
Approximately 1.2kVA (1.1kW) |
Single phase AC100V±5% 50/60Hz (a transformer is required for other voltages) |
500kPa (5kgf/cm2) 102L/min |
Approximately 520kg |
・W 1,244mm |
Operation rate management etc. using production management screen |
Recoilless servo system by Shinkawa NRS |
Wire bonder |
・XY table 0.1μm |
・Width 20~102mm |
Gold wire φ18~50μm |
Fully automatic magazine stacker method (stocker method can be selected as an option) |
3~1,000gf |
±3.0μm (3σ) (depending on sample and temperature conditions) |
Maximum 4mm (varies depending on device conditions) |
Up to 12,000 wires |
42ms/0.7mm wire (45ms/2mm wire) (With loop control. When using load detection mode) Based on our standard sample |
・X 66mm - camera offset |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
39.3hrs
