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Response Rate
100.0%
Response Time
39.3hours
Product
High-speed Cu wire bonder for wide frame UTC-5000WE NeoCuHandling Company
Yamaha Robotics Holdings Co., Ltd.Categories
| Image | Part Number | Price (excluding tax) | Drive source vacuum | Drive source Power consumption | Drive source Input power supply | Drive source air | Power specifications | Mass | Equipment dimensions | Production management | Vibration suppression method | Product name | Control resolution resolution | Work size | Wire diameter | Loader unloader | Bond load | Bonding accuracy | Bonding position correction | Bonding wire length | Number of bonding wires | Bonding speed | Bonding area | Option |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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UTC-5000WE NeoCu |
Available upon quote |
-74kPa (-550mmHg) or less (gauge pressure) |
Approximately 1.3kVA |
Single phase AC100V±5% 50/60Hz (a transformer is required for other voltages) |
500kPa (5kgf/cm2) 100L/min |
・X ±28mm |
Approximately 520kg |
・W 1,244mm |
Operation rate management etc. using production management screen |
Recoilless servo system by Shinkawa NRS |
Wire bonder |
・XY table 0.1μm |
・Width 20~100mm (20~95mm for carrier) |
Gold wire Copper wire Pd coated copper wire Silver wire φ18~65μm (φ18~30μm for bump bonding) |
Fully automatic magazine stacker method (stocker method can be selected as an option) |
3~1,000gf |
±2.0μm (3σ) Based on our standard sample |
Offset amount pre-bonding confirmation correction system using Shinkawa RPS (combined with offset amount correction using temperature detection) |
Maximum 8mm (varies depending on device conditions) |
Up to 30,000 wires |
48ms/2mm wire (with loop control. When using load detection mode) Based on our standard sample |
2~30mm |
Communication interface SECS I/SECSII, HSMS, GEM |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
39.3hrs
