High-speed Au wire bonder UTC-5000Super
Yamaha Robotics Holdings Co., Ltd.
About This Product
■Summary
・High-speed wire bonder that is the culmination of the series
・Upgraded version of basic model for gold wire bonding
・Improve device functions and performance through software upgrades.
・Enriched condition setting assist function makes it easy to start up new products
・Monitoring equipment status to ensure safe production
・High-quality optical system improves recognition
・Reduce waste in bonding operations and increase UPH
・Improved usability through standardization of options and convenient functions
・Fail-safe to prevent damage due to incorrect operation or abnormality
■Features
・New function SimLoop installed as standard. Automatic loop shape optimization and loop shape editor reduce work time. Overdrive mode increases UPH by approximately 7%
・Equipped as standard with Neo-Cut function, which is effective for fine-pitch bump formation, and Neo-Step function, which can optimize the bonding process.
・Neo-Spark function that realizes a stable initial ball shape (optional)
・A platform that achieves high-speed bonding of 45ms/2mm by completely redesigning the X, Y, and Z motors.
・Achieved bonding accuracy of ±2.0μm (3σ)
・Equipped with a bonding head that supports a maximum bond load of 1,000gf and a high-rigidity transducer, enabling high-quality mounting even with QFN and thick Cu wire (additional unit required for Cu wiring)
・Equipped with an EFU power supply that can handle sizes from φ15 to 50 μm without changing the unit.
Usage example
■Capillary Wedge Bonding (CWB) connected with a thin chain
NAND flash memory is widely used as a storage medium, from USB memory to cloud servers, and is bonded by stacking many dies to increase capacity. Signals from the stacked dies are transmitted by wire-bonded metal wires. Generally, the process requires repeated bonding and wire cutting for each stage, which is a time-consuming process, and has become a bottleneck in improving productivity.
In response, Shinkawa has developed Capillary Wedge Bonding (CWB) technology, which allows multiple connections to be made at once without cutting the wires. Since this technology is expected to significantly shorten the takt time, Shinkawa is continuing to improve this technology so that it can be used by a wide range of customers.
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Product
High-speed Au wire bonder UTC-5000Super
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Handling Company
Yamaha Robotics Holdings Co., Ltd.
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Categories
1 Models of High-speed Au wire bonder UTC-5000Super
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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UTC-5000Super |
Available upon quote |
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