High-speed Cu wire bonder UTC-5000NeoCu Super
Yamaha Robotics Holdings Co., Ltd.
About This Product
■Summary
・High-speed Cu wire bonder that is the culmination of the series
・Upgraded version of multi-wire compatible model that supports Cu wire, PCC wire, and Ag wire
・Improve device functions and performance through software upgrades.
・Enriched condition setting assist function makes it easy to start up new products
・Monitoring equipment status to ensure safe production
・High-quality optical system improves recognition
・Reduce waste in bonding operations and increase UPH
・Improved usability through standardization of options and convenient functions
・Fail-safe to prevent damage due to incorrect operation or abnormality
■Features
・New function SimLoop installed as standard
・Save work time with automatic loop shape optimization and loop shape editor
・Overdrive mode improves UPH by approximately 7%
- Compatible with bare or Pd coated Cu wire
・Reduced product change time by digitizing inert gas flow rate settings
- Equipped as standard with the Neo-Spark function that realizes a stable initial ball shape, the Neo-Cut function that is effective for fine pitch bump formation, and the Neo-Step function that optimizes the bonding process.
・A platform that achieves high-speed bonding of 45ms/2mm by completely redesigning the X, Y, and Z motors.
・Achieved bonding accuracy of ±2.0μm (3σ)
・Equipped with a bonding head that supports a maximum bond load of 1,000gf and a high-rigidity transducer, enabling high-quality mounting even with QFN and thick Cu wire.
・Equipped with an EFU power supply that can handle sizes from φ15 to 50 μm without changing the unit.
Usage example
■Capillary Wedge Bonding (CWB) connected with a thin chain
NAND flash memory is widely used as a storage medium, from USB memory to cloud servers, and is bonded by stacking many dies to increase capacity. Signals from the stacked dies are transmitted by wire-bonded metal wires. Generally, the process requires repeated bonding and wire cutting for each stage, which is a time-consuming process, and has become a bottleneck in improving productivity.
In response, Shinkawa has developed Capillary Wedge Bonding (CWB) technology, which allows multiple connections to be made at once without cutting the wires. Since this technology is expected to significantly shorten the takt time, Shinkawa is continuing to improve this technology so that it can be used by a wide range of customers.
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Product
High-speed Cu wire bonder UTC-5000NeoCu Super
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Handling Company
Yamaha Robotics Holdings Co., Ltd.
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Categories
1 Models of High-speed Cu wire bonder UTC-5000NeoCu Super
| Product Image | Part Number | Price (excluding tax) |
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UTC-5000NeoCu Super |
Available upon quote |
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