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Response Rate
100.0%
Response Time
39.3hours
Product
High-speed bump bonder for wide areas for wafers SBB-5200Handling Company
Yamaha Robotics Holdings Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | Drive source vacuum | Drive source Power consumption | Drive source Input power supply | Drive source air | Mass | Equipment dimensions | Production management | Vibration suppression method | Product name | Control resolution resolution | Wire diameter | Bond load | Bonding accuracy | Bonding position correction | Number of bonding bumps | Bonding speed | Bonding area | Wafer stage | Wafer size size | Wafer size thickness | Option |
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SBB-5200 |
Available upon quote |
-74kPa (-550mmHg) or less (gauge pressure) |
Approximately 1.1 kVA |
Single phase AC100V±5% 50/60Hz (a transformer is required for other voltages) |
500kPa (5kgf/cm2) 100L/min. |
Approximately 500kg |
・W 1,000mm |
Operation rate management etc. using production management screen |
Recoilless servo system by Shinkawa NRS |
Bump bonder |
・XY table: 0.1 μm |
Gold wire φ15~32μm |
Max 4.9N |
±2.5μm (3σ) Based on our standard sample |
Offset amount pre-bonding confirmation correction system using Shinkawa RPS |
Up to 30,000 bumps |
30ms/bump (no reverse operation) Based on our standard sample |
Maximum φ150mm (6 inch wafer) |
6 inch 2 wafer stage *With temperature control function |
Maximum 6 inches (parts must be changed when changing wafer size) |
0.15~0.6mm (When changing wafer thickness, parts may need to be changed) |
6 inch wafer autoloader |
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Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
39.3hrs