High-speed bump bonder for wide areas for wafers SBB-5200
Yamaha Robotics Holdings Co., Ltd.
About This Product
■Features
・By using wire bonder UTC-5000 as a base, high-speed bonding of 30ms/bump is achieved.
・Equipped with a wafer rotation stage, it is possible to bond wafers up to 6 inches.
・Equipped with 2 wafer stage specifications and temperature increase/decrease control function to shorten SAW FILTER wafer exchange time and improve productivity.
・Measure the initial ball diameter using the initial ball diameter automatic monitoring function (FAM)
・Equipped with a wafer autoloader for automatic wafer exchange (optional)
Usage example
■BIM:Bond Inspection Measurement (bond ball position detection function)
BIM is a function that calculates the amount of deviation of the bonding position from the image after bonding and corrects the bonding position. Positional deviations caused by various fluctuations during bonding are corrected in real time to stabilize bonding accuracy.
■FAM:Free Air ball Measurement (initial ball automatic monitoring function)
FAM is Shinkawa's unique function that stabilizes the initial ball shape by monitoring the diameter and shape of the initial ball during wire bonding. For detection, we utilize a function called Reference Positioning System (RPS) that images the capillary tip position. This function supports the high reliability bonding of the UTC-5000 series.
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Product
High-speed bump bonder for wide areas for wafers SBB-5200
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Handling Company
Yamaha Robotics Holdings Co., Ltd.
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Categories
1 Models of High-speed bump bonder for wide areas for wafers SBB-5200
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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SBB-5200 |
Available upon quote |
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