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High-speed bump bonder for wide areas for wafers SBB-5200-SBB-5200
High-speed bump bonder for wide areas for wafers SBB-5200-Yamaha Robotics Holdings Co., Ltd.

High-speed bump bonder for wide areas for wafers SBB-5200
Yamaha Robotics Holdings Co., Ltd.

Yamaha Robotics Holdings Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

39.3hours


About This Product

■Features

・By using wire bonder UTC-5000 as a base, high-speed bonding of 30ms/bump is achieved. ・Equipped with a wafer rotation stage, it is possible to bond wafers up to 6 inches. ・Equipped with 2 wafer stage specifications and temperature increase/decrease control function to shorten SAW FILTER wafer exchange time and improve productivity. ・Measure the initial ball diameter using the initial ball diameter automatic monitoring function (FAM) ・Equipped with a wafer autoloader for automatic wafer exchange (optional) Usage example

■BIM:Bond Inspection Measurement (bond ball position detection function)

BIM is a function that calculates the amount of deviation of the bonding position from the image after bonding and corrects the bonding position. Positional deviations caused by various fluctuations during bonding are corrected in real time to stabilize bonding accuracy.

■FAM:Free Air ball Measurement (initial ball automatic monitoring function)

FAM is Shinkawa's unique function that stabilizes the initial ball shape by monitoring the diameter and shape of the initial ball during wire bonding. For detection, we utilize a function called Reference Positioning System (RPS) that images the capillary tip position. This function supports the high reliability bonding of the UTC-5000 series.

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    High-speed bump bonder for wide areas for wafers SBB-5200

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1 Models of High-speed bump bonder for wide areas for wafers SBB-5200

Image Part Number Price (excluding tax) Drive source vacuum Drive source Power consumption Drive source Input power supply Drive source air Mass Equipment dimensions Production management Vibration suppression method Product name Control resolution resolution Wire diameter Bond load Bonding accuracy Bonding position correction Number of bonding bumps Bonding speed Bonding area Wafer stage Wafer size size Wafer size thickness Option
High-speed bump bonder for wide areas for wafers SBB-5200-Part Number-SBB-5200

SBB-5200

Available upon quote

-74kPa (-550mmHg) or less (gauge pressure)

Approximately 1.1 kVA

Single phase AC100V±5% 50/60Hz (a transformer is required for other voltages)

500kPa (5kgf/cm2) 100L/min.

Approximately 500kg

・W 1,000mm
・D 1,084mm
・H 2,092mm

Operation rate management etc. using production management screen

Recoilless servo system by Shinkawa NRS

Bump bonder

・XY table: 0.1 μm
・Z-axis: 0.1μm

Gold wire φ15~32μm

Max 4.9N

±2.5μm (3σ) Based on our standard sample

Offset amount pre-bonding confirmation correction system using Shinkawa RPS

Up to 30,000 bumps

30ms/bump (no reverse operation) Based on our standard sample

Maximum φ150mm (6 inch wafer)

6 inch 2 wafer stage *With temperature control function

Maximum 6 inches (parts must be changed when changing wafer size)

0.15~0.6mm (When changing wafer thickness, parts may need to be changed)

6 inch wafer autoloader

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About Company Handling This Product

Response Rate

100.0%


Response Time

39.3hrs

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