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Vitrified diamond wheel nanoVi for semiconductor wafer grinding-NanoVi
Vitrified diamond wheel nanoVi for semiconductor wafer grinding-JTEKT Grinding Tools Co., Ltd.

Vitrified diamond wheel nanoVi for semiconductor wafer grinding
JTEKT Grinding Tools Co., Ltd.


About This Product

■Features

By developing an innovative manufacturing method to uniformize ultra-fine diamond particles with the industry's smallest particle size of 0.5 μm, we have achieved both excellent sharpness retention and low wear rate in SiC wafer grinding, contributing to improved productivity. High-quality grinding with a surface roughness of Sa1.2nm was achieved in 8-inch SiC wafer grinding.

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    Vitrified diamond wheel nanoVi for semiconductor wafer grinding

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1 Models of Vitrified diamond wheel nanoVi for semiconductor wafer grinding

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Vitrified diamond wheel nanoVi for semiconductor wafer grinding-Part Number-NanoVi

NanoVi

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