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Dicing system ADT8030-ADT8030
Dicing system ADT8030-Nippon Gijutsu Sangyo Co., Ltd.

Nippon Gijutsu Sangyo Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

70.2hours


About This Product

The ADT8030 dicing system has two opposed spindles that can simultaneously dice wafers at high throughput. The ADT8030 is a high-precision system capable of dicing products up to 12 inches in diameter or 12 inches x 12 inches with high performance and low cost.

■Features and benefits

Flexibility - Supports hub and hubless blades up to 3" outside diameter. ・1.8kW or 2.2kW high output spindle ・Bridge type frame that supports efficient wafer processing ・Intuitive operation interface using large 19-inch touch screen monitor ・Fast and easy blade replacement with locking spindle shaft ・SECS/GEM platform compatible

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    Dicing system ADT8030

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1 Models of Dicing system ADT8030

Image Part Number Price (excluding tax) Weight Utility electricity Cleaning method Washing station Dimensions (W×D×H) mm Rotation speed Work size Blade size Spindle Θ axis repeatability Θ axis stroke Z1/Z2 axis resolution Z1/Z2 axis repeatability Z1/Z2 axis stroke Y1/Y2 axis feed accuracy Y1/Y2 axis cumulative accuracy Y1/Y2 axis control Y1/Y2 axis cutting range Y1/Y2 axis resolution X axis
Dicing system ADT8030-Part Number-ADT8030

ADT8030

Available upon quote

1,500kg

200~240VAC, 50/60Hz, single phase

Spray cleaning function

Complete rinse & dry cycle

1,145×1,687×1,830

100~3,000rpm

Φ8", φ12" or 12" x 12" square

2"~3

Face-to-face type 1.8kw or 2.2kw shaft lock spindle, max.60,000rpm

4 arc seconds

380°

0.2μm

1.0μm

50mm (blade outer diameter 2.188")

1.0μm

1.5μm

Linear encoder for both Y axes

350mm

0.1μm

Air slide

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About Company Handling This Product

Response Rate

100.0%


Response Time

70.2hrs

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