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Dicing machine for square substrates for 2 inch spindle 7302-7302
Dicing machine for square substrates for 2 inch spindle 7302-Nippon Gijutsu Sangyo Co., Ltd.

Dicing machine for square substrates for 2 inch spindle 7302
Nippon Gijutsu Sangyo Co., Ltd.

Nippon Gijutsu Sangyo Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

70.2hours


About This Product

■Dicing saw

Cutting equipment used in the semiconductor chip production process. Machining is done by rotating a rotary blade embedded with industrial diamonds at high speed. In addition to cutting, it can also be used for grooving.

■Summary

The 73xx series is a single-axis dicing saw that can dice square workpieces. Sizes up to 9" x 12" and available in two configurations. Features and benefits

■The 7302 dicing saw can be configured with the following options.

- Broken Blade Detector (BBD) ・High output 2-inch spindle with maximum output of 2.2kW

■73xx configurable options

・75mm x 75mm large dress station board ・UV LED curing system ・Exhaust impeller ・Height measurement tool (HMT) ・ESD kit · UPS ・Barcode reader (internal or external) ・SECS GEM communication protocol Note: Specifications are subject to change without notice.

  • Product

    Dicing machine for square substrates for 2 inch spindle 7302

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1 Models of Dicing machine for square substrates for 2 inch spindle 7302

Image Part Number Price (excluding tax)
Dicing machine for square substrates for 2 inch spindle 7302-Part Number-7302

7302

Available upon quote

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About Company Handling This Product

Response Rate

100.0%


Response Time

70.2hrs

  • Japan

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