Laser shield cutter SC-10FL
MK Electronics Co., Ltd.
About This Product
Cable terminal processing using laser. A laser shield cutter that can uniformly process shield wires and metal tapes all around.
■The shield wire does not dig into the dielectric material.
In the case of a mechanical stripper that uses a knife, the shield wire is cut while applying pressure from the outside, which causes the shield wire to dig into the dielectric material. This may affect the wire characteristics. Since the laser is non-contact, it does not affect dielectric materials.
■Recommended processing method
A laser shield cutter makes uniform cuts around the entire circumference of the shield wire, and a "shield stripper" that uses a rotating brush allows the shield wire to be neatly removed.
■Significant reduction in processing time
The YVO4 laser has a higher repetition rate than the YAG laser, which is commonly used for laser processing, and can process at high speed, while also suppressing the thermal effects on the surrounding area and the underlying material.
■No uncut parts, no scratches on dielectric material
In the case of unidirectional irradiation equipment using a laser marker or other general two-direction irradiation laser processing machines, there are areas where the laser is not sufficiently irradiated. This machine uses a unique device mechanism to irradiate lasers from four diagonal directions. Cut evenly around the entire circumference of the shield.
■Achieve micro-machining and high-precision machining
Appropriate optical design achieves both necessary work distance and small focal diameter. Since the power necessary for processing is focused down to approximately 30 μm, most of the energy is used for "cutting". It has a sharp cutting edge that does not cause unnecessary heat effects on the surrounding area of the workpiece, allowing for fine, high-precision machining.
■Extra-fine braided wire also requires no preliminary soldering
Braided shielded wire has parts where the wire is double thick and parts with gaps as shown below. When irradiated with a laser, the inner layer shield wire remains uncut in the double areas, and the laser penetrates into the internal dielectric material in the gap areas, causing damage. Therefore, it takes time and effort to perform "preliminary soldering" and then cut the shield.
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Product
Laser shield cutter SC-10FL
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Handling Company
MK Electronics Co., Ltd.
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Categories
1 Models of Laser shield cutter SC-10FL
| Product Image | Part Number | Price (excluding tax) |
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SC-10FL |
Available upon quote |
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About Company Handling This Product
- Japan