Peltier module
Pulse Electronics Co., Ltd.
About This Product
■Peltier element
Unlike conventional cooling methods that use catalysts and compressors, Peltier cooling equipment does not use CFC gas that destroys the ozone layer, so it is environmentally friendly and suitable for all fields (food, industry, optics, medical physics and chemistry, measurement and analysis, This is an excellent cooling method that is often used in particularly severe fields such as semiconductors.
■Peltier effect
When a DC voltage is applied to a Peltier element, a temperature difference is created on both sides of the element, and the temperature on the heat-generating side (higher temperature) and the heat-absorbing side become lower (cooling). This effect is called the Peltier effect. Utilizing this effect, it is applied to electronic constant temperature devices, small refrigerators, tabletop refrigerators, etc. It is small and lightweight, does not use refrigerants such as fluorocarbons, has no impact on the environment, and does not use a compressor, so it vibrates. It is characterized by many advantages such as no noise and long life.
The Peltier module is a high-quality product that is carefully produced by G-MAX and created under strict quality control.
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Product
Peltier module
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Handling Company
Pulse Electronics Co., Ltd.
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Categories
10 Models of Peltier module
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Guaranteed operating temperature range | Leader line standard | Maximum allowable compressive load | Maximum compressive static load | Maximum current | Maximum heat absorption | Maximum temperature difference | Maximum voltage | Modular structure | Moisture resistant seal | Resistance value | Solder melting point | Solder used |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1707NC |
Available upon quote | -40℃~100℃ | UL standard | 1 MPa | 1MPa | 6.0A |
Th=27℃: 7.4W Th=50℃: 8.2W |
Th=27℃: 70℃ Th=50℃: 77℃ |
2.1V | Normal structure | Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. | 0.3Ω ± 10% | 235℃ | Lead-free solder: Sn-Sb (5%) |
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1708NC |
Available upon quote | -40℃~100℃ | UL standard | 1 MPa | 1MPa | 8.5A |
Th=27℃: 10.3W Th=50℃: 11.3W |
Th=27℃: 70℃ Th=50℃: 77℃ |
2.1V | Normal structure | Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. | 0.2Ω ± 10% | 235℃ | Lead-free solder: Sn-Sb (5%) |
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3102NC |
Available upon quote | -40℃~100℃ | UL standard | 1 MPa | 1MPa | 2.0 A |
Th=27℃: 4.4W Th=50℃: 5.0W |
Th=27℃: 70℃ Th=50℃: 77℃ |
3.8V | Normal structure | Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. | 1.65Ω ± 10% | 235℃ | Lead-free solder: Sn-Sb (5%) |
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3103NC |
Available upon quote | -40℃~100℃ | UL standard | 1 MPa | 1MPa | 3.0A |
Th=27℃: 7.3W Th=50℃: 8.0W |
Th=27℃: 70℃ Th=50℃: 77℃ |
3.8V | Normal structure | Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. | 1.0 Ω ± 10% | 235℃ | Lead-free solder: Sn-Sb (5%) |
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3104NC |
Available upon quote | -40℃~100℃ | UL standard | 1 MPa | 1MPa | 3.9A |
Th=27℃: 8.6W Th=50℃: 9.5W |
Th=27℃: 70℃ Th=50℃: 77℃ |
3.8V | Normal structure | Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. | 0.85Ω ± 10% | 235℃ | Lead-free solder: Sn-Sb (5%) |
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3106NC |
Available upon quote | -40℃~100℃ | UL standard | 1 MPa | 1MPa | 6.0A |
Th=27℃: 13.0W Th=50℃: 14.3W |
Th=27℃: 70℃ Th=50℃: 77℃ |
3.8V | Normal structure | Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. | 0.45Ω ± 10% | 235℃ | Lead-free solder: Sn-Sb (5%) |
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3107NC |
Available upon quote | -40℃~100℃ | UL standard | 1 MPa | 1MPa | 6.0A |
Th=27℃: 13.6W Th=50℃: 14.9W |
Th=27℃: 70℃ Th=50℃: 77℃ |
3.8V | Normal structure | Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. | 0.55Ω ± 10% | 235℃ | Lead-free solder: Sn-Sb (5%) |
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3108NC |
Available upon quote | -40℃~100℃ | UL standard | 1 MPa | 1MPa | 8.5A |
Th=27℃: 18.8W Th=50℃: 20.8W |
Th=27℃: 70℃ Th=50℃: 77℃ |
3.8V | Normal structure | Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. | 0.35Ω ± 10% | 235℃ | Lead-free solder: Sn-Sb (5%) |
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7102NC |
Available upon quote | -40℃~100℃ | UL standard | 1 MPa | 1MPa | 2.0 A |
Th=27℃: 10.2W Th=50℃: 11.2W |
Th=27℃: 70℃ Th=50℃: 77℃ |
8.8V | Normal structure | Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. | 0.37Ω ± 10% | 235℃ | Lead-free solder: Sn-Sb (5%) |
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7103NC |
Available upon quote | -40℃~100℃ | UL standard | 1 MPa | 1MPa | 3.0A |
Th=27℃: 16.6W Th=50℃: 18.0W |
Th=27℃: 70℃ Th=50℃: 77℃ |
8.8V | Normal structure | Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. | 2.2Ω ± 10% | 235℃ | Lead-free solder: Sn-Sb (5%) |
Click on the part number for more information about each product
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