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Peltier moduleHandling Company
Pulse Electronics Co., Ltd.Categories
Click on the part number for more information about each product
Image | Part Number | Price (excluding tax) | Maximum allowable compressive load | Moisture resistant seal | Maximum current | Maximum voltage | Maximum temperature difference | Maximum compressive static load | Maximum heat absorption | Resistance value | Leader line standard | Solder melting point | Guaranteed operating temperature range | Solder used | Modular structure |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
1707NC |
Available upon quote |
1 MPa |
Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. |
6.0A |
2.1V |
Th=27℃: 70℃ |
1MPa |
Th=27℃: 7.4W |
0.3Ω ± 10% |
UL standard |
235℃ |
-40℃~100℃ |
Lead-free solder: Sn-Sb (5%) |
Normal structure |
|
1708NC |
Available upon quote |
1 MPa |
Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. |
8.5A |
2.1V |
Th=27℃: 70℃ |
1MPa |
Th=27℃: 10.3W |
0.2Ω ± 10% |
UL standard |
235℃ |
-40℃~100℃ |
Lead-free solder: Sn-Sb (5%) |
Normal structure |
|
3102NC |
Available upon quote |
1 MPa |
Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. |
2.0 A |
3.8V |
Th=27℃: 70℃ |
1MPa |
Th=27℃: 4.4W |
1.65Ω ± 10% |
UL standard |
235℃ |
-40℃~100℃ |
Lead-free solder: Sn-Sb (5%) |
Normal structure |
|
3103NC |
Available upon quote |
1 MPa |
Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. |
3.0A |
3.8V |
Th=27℃: 70℃ |
1MPa |
Th=27℃: 7.3W |
1.0 Ω ± 10% |
UL standard |
235℃ |
-40℃~100℃ |
Lead-free solder: Sn-Sb (5%) |
Normal structure |
|
3104NC |
Available upon quote |
1 MPa |
Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. |
3.9A |
3.8V |
Th=27℃: 70℃ |
1MPa |
Th=27℃: 8.6W |
0.85Ω ± 10% |
UL standard |
235℃ |
-40℃~100℃ |
Lead-free solder: Sn-Sb (5%) |
Normal structure |
|
3106NC |
Available upon quote |
1 MPa |
Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. |
6.0A |
3.8V |
Th=27℃: 70℃ |
1MPa |
Th=27℃: 13.0W |
0.45Ω ± 10% |
UL standard |
235℃ |
-40℃~100℃ |
Lead-free solder: Sn-Sb (5%) |
Normal structure |
|
3107NC |
Available upon quote |
1 MPa |
Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. |
6.0A |
3.8V |
Th=27℃: 70℃ |
1MPa |
Th=27℃: 13.6W |
0.55Ω ± 10% |
UL standard |
235℃ |
-40℃~100℃ |
Lead-free solder: Sn-Sb (5%) |
Normal structure |
|
3108NC |
Available upon quote |
1 MPa |
Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. |
8.5A |
3.8V |
Th=27℃: 70℃ |
1MPa |
Th=27℃: 18.8W |
0.35Ω ± 10% |
UL standard |
235℃ |
-40℃~100℃ |
Lead-free solder: Sn-Sb (5%) |
Normal structure |
|
7102NC |
Available upon quote |
1 MPa |
Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. |
2.0 A |
8.8V |
Th=27℃: 70℃ |
1MPa |
Th=27℃: 10.2W |
0.37Ω ± 10% |
UL standard |
235℃ |
-40℃~100℃ |
Lead-free solder: Sn-Sb (5%) |
Normal structure |
|
7103NC |
Available upon quote |
1 MPa |
Seal the module side surface with KE347 (Shin-Etsu Silicone) or equivalent product. |
3.0A |
8.8V |
Th=27℃: 70℃ |
1MPa |
Th=27℃: 16.6W |
2.2Ω ± 10% |
UL standard |
235℃ |
-40℃~100℃ |
Lead-free solder: Sn-Sb (5%) |
Normal structure |
Click on the part number for more information about each product
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