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  4. Femtosecond laser ultra-fine processing equipment compatible with all materials including biological samples, transparent materials, thin films, etc. (Tokyo Instruments, Inc)
Femtosecond laser ultra-fine processing equipment compatible with all materials including biological samples, transparent materials, thin films, etc.-Picosecond laser
Femtosecond laser ultra-fine processing equipment compatible with all materials including biological samples, transparent materials, thin films, etc.-Tokyo Instruments, Inc

Femtosecond laser ultra-fine processing equipment compatible with all materials including biological samples, transparent materials, thin films, etc.
Tokyo Instruments, Inc

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About This Product

■Femtosecond laser ultra-fine processing equipment Overview

This device is specialized in processing that takes full advantage of the features of femtosecond lasers, and can perform precise microprocessing on all kinds of materials, including delicate biological samples, transparent materials, and thin films. In addition, in recent years, photon craft technology has been applied as a new biomolecular scalpel that does not damage surrounding tissues and cells for biological samples that are sensitive to thermal effects.

■Flexible micro-processing of all materials with minimal thermal effects

In the case of femtosecond lasers, light energy is irradiated onto the processed material in an extremely short period of time, so processing occurs before heat is generated, and only the irradiated area is blown away. Therefore, it is possible to perform sharp machining with almost no visible heat effects around the machining area.

■Processing resolution that exceeds the diffraction limit using multiphoton absorption

If the light to be irradiated onto the material to be processed is transparent, the femtosecond laser can be used to irradiate the inside of the material in a strong condensed manner (irradiating high-density light energy in an extremely short period of time) using an objective lens etc. Light absorption (multiphoton absorption) occurs only in transparent materials, and it is possible to process them inside transparent materials. Furthermore, the processing area at the focal point has a processing resolution that exceeds the diffraction limit of light (<300nm).

■Direct drawing function (creating processing patterns on the microscope image)

It is possible to intuitively draw on the touch panel monitor while checking the microscopic image of the processed material.

■High-precision autofocus mechanism using confocal optical system

By adopting a confocal optical system, highly accurate surface position detection is possible even for processed materials with low reflectance. As an applied function of autofocus, processing can be performed taking into account tilt correction and rotation correction of the processed material.

■Compatible with various lasers

It can also be used with various lasers other than femtosecond lasers.

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    Femtosecond laser ultra-fine processing equipment compatible with all materials including biological samples, transparent materials, thin films, etc.

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1 Models of Femtosecond laser ultra-fine processing equipment compatible with all materials including biological samples, transparent materials, thin films, etc.

Image Part Number Price (excluding tax) Sample stand Repetition frequency Laser wavelength Irradiation/observation unit Control unit Optical vibration isolation table Optical unit Positioning stage configuration example Pulse width Pulse energy
Femtosecond laser ultra-fine processing equipment compatible with all materials including biological samples, transparent materials, thin films, etc.-Part Number-Picosecond laser

Picosecond laser

Available upon quote

Suction table (stainless steel)

Single shot ~1MHz

1,064/532/355nm

Microscope base housing available, irradiation optical system, observation optical system

System control driver/controller, power control box, control software

Three-dimensional air spring type vibration isolation table

Energy control, polarization control, beam shaping (top hat beam, etc.)

XY axis: Machining range ±50mm, resolution 2µm, maximum travel 16mm/s Z axis: Machining range 0~20mm, resolution 1µm, maximum travel 5mm/s

＜10ps

30~200µJ@1,064nm 20~100µJ@1,064nm 10~75µJ@1,064nm

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About Company Handling This Product

Tokyo Instruments, Inc

Response Rate

100.0%

Response Time

24.1hrs

Company Overview

Tokyo Instruments, Inc., established in 1981, and headquartered in Tokyo, Japan, is a manufacturer of opto-ele...

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