Conductive film (Cu vapor deposition)
Reiko Co., Ltd.
About This Product
Adds conductivity to various base materials (PET, PI, etc.). Can be used as a substitute for copper foil and as a plating seed layer. Achieves conductivity and low reflection by blackening the base material.
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Product
Conductive film (Cu vapor deposition)
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Handling Company
Reiko Co., Ltd.
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Categories
1 Models of Conductive film (Cu vapor deposition)
| Product Image | Part Number | Price (excluding tax) | Cross cut close contact | Cu film thickness (µm) | Surface resistivity (Ω/□) |
|---|---|---|---|---|---|
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Conductive film (Cu vapor deposition) |
Available upon quote | 100/100 |
0.1 0.3 1.0 (development product) |
2.0×10^-1 8.0×10^-2 1.7×10^-2 |
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About Company Handling This Product
- Japan