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Conductive film (Cu vapor deposition)-Conductive film (Cu vapor deposition)
Conductive film (Cu vapor deposition)-Reiko Co., Ltd.

Conductive film (Cu vapor deposition)
Reiko Co., Ltd.

Reiko Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

35.7hours


About This Product

Adds conductivity to various base materials (PET, PI, etc.). Can be used as a substitute for copper foil and as a plating seed layer. Achieves conductivity and low reflection by blackening the base material.

  • Product

    Conductive film (Cu vapor deposition)

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1 Models of Conductive film (Cu vapor deposition)

Image Part Number Price (excluding tax) Surface resistivity (Ω/□) Cross cut close contact Cu film thickness (µm)
Conductive film (Cu vapor deposition)-Part Number-Conductive film (Cu vapor deposition)

Conductive film (Cu vapor deposition)

Available upon quote

2.0×10^-1
8.0×10^-2
1.7×10^-2

100/100

0.1
0.3
1.0 (development product)

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About Company Handling This Product

Response Rate

100.0%


Response Time

35.7hrs

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