Demand is increasing Taping machine for extremely small and thin devices Wafer ring supply taping machine NCT-6300R series
YAC GARTER CO .,LTD
About This Product
This is a device that tapes only non-defective devices supplied from wafer rings based on the results of electrical property and appearance inspections. Damage-free technology during pickup, centering, transportation, and storage enables high-speed transportation without damaging even the smallest and thinnest devices. We contribute to improving the durability and reliability of our customers' products.
■Damageless pickup method
The original needle cover unit developed by our company can minimize damage to the device during pickup, which is an issue faced by many customers.
■Non-contact centering technology
One of the technologies to reduce damage is to correct the position of the device without pinching it. Non-contact centering is achieved by correcting the position based on image information.
■Damage-free insertion device
By limiting the load when inserting the tape, damage to extremely small devices is reduced. This device is designed to completely eliminate damage to devices, from pickup to tape insertion.
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Product
Demand is increasing Taping machine for extremely small and thin devices Wafer ring supply taping machine NCT-6300R series
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Handling Company
YAC GARTER CO .,LTD
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Categories
1 Models of Demand is increasing Taping machine for extremely small and thin devices Wafer ring supply taping machine NCT-6300R series
| Product Image | Part Number | Price (excluding tax) | Embossed carrier tape width | External dimensions | Option | Power supply | Processing capacity | Reel diameter (storage) | Supply method | Target product size | Target products | Touch panel |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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NCT-6300R |
Available upon quote | 8.0, 12.0 [mm] | W1,660×H2,000×D1,620 [mm] |
・Appearance inspection function ・In-tape image inspection function ・Electrical property inspection function ・Sub table ・Classification function (up to 10 classifications) ・Auto-reject function ・Auto cutter ・Upper communication ・Full cover |
Single phase AC200V / AC220V / AC230V 50/60 [Hz] (Transformer tap switching) |
0.06 seconds/piece | Supply side: Maximum φ600mm / Winding side: Maximum φ330mm | Wafer ring (up to 8 inch size) | 0.6×0.3mm~ | WLCSP, power semiconductors, diodes, transistors, LEDs, crystal devices, various chip parts | Supports 4 languages (Japanese, English, Chinese, Korean) |
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About Company Handling This Product
- Japan