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Leaded solder solder paste standard type FC63-BZ (L)-FC63-BZ (L)
Leaded solder solder paste standard type FC63-BZ (L)-Matsuo Handa Co., Ltd.

Leaded solder solder paste standard type FC63-BZ (L)
Matsuo Handa Co., Ltd.

Matsuo Handa Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

111.5hours


About This Product

Reduces solder balls and enables stable printing. Contributes to reducing waste solder paste.

■ Significantly reduces solder balls

By suppressing slump (flowing under the component or out of the land) during preheating using our unique flux technology, we are now able to reduce the occurrence of solder balls.

■Good printing stability

Since it uses an activator that is extremely stable at room temperature, it exhibits stable printing performance even during long printing operations (rolling), contributing to the reduction of waste solder paste.

■Insulation resistance test (85℃ 85%RH 168hr)

5.0×10^8Ω or more (JIS Z3197)

■Migration test (85℃ 85%RH 1,000hr)

No abnormality (JIS Z3197)

  • Product

    Leaded solder solder paste standard type FC63-BZ (L)

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1 Models of Leaded solder solder paste standard type FC63-BZ (L)

Image Part Number Price (excluding tax) Copper plate corrosion test (test standard) Viscosity properties Pa・s (test standard) Liquidus temperature ℃ (test standard) Spread rate % (test standard) Solidus temperature ℃ (test standard) Alloy composition % (test standard) Flux content % (test standard) Halide content % (test standard) Thixotropic index (test standard) Solder powder size μm (test standard)
Leaded solder solder paste standard type FC63-BZ (L)-Part Number-FC63-BZ (L)

FC63-BZ (L)

Available upon quote

Passed (JIS Z3197)

190 (JIS Z3284)

Approximately 183 (JIS Z3282)

96 (JIS Z3197)

Approximately 183 (JIS Z3282)

Sn63-Pb37 (JIS Z3282)

10.2 (JIS Z3197)

0.05 (JIS Z3197)

0.56 (JIS Z3284)

20~38 Type4 (JIS Z3284 J-STD-005)

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About Company Handling This Product

Response Rate

100.0%


Response Time

111.5hrs

  • Japan

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