Laser soldering compatible product Supports localized rapid heating and prevents scattering Laser solder paste FLF01-BM (D)-FLF01-BM (D)

Laser soldering compatible product Supports localized rapid heating and prevents scattering Laser solder paste FLF01-BM (D)
Matsuo Handa Co., Ltd.

About This Product

■Product that suppresses rapid heating and scattering during non-contact laser solderingSolder paste for lasers Even during rapid heating during laser soldering, wetting is good and flux scattering is suppressed.

■Flux scattering control, good finish・Test conditions Semiconductor laser FOM-B454-S002 output 15W 1.5sec.
・No scattering due to cohesive force even after rapid laser heating.

■Excellent wetnessNo flow of unmolten solder powder and flux aggregation effect.

BM (D) 4 characteristics
■Good finishThe laser method, which is good at localized rapid heating, efficiently releases outgas even when the temperature is raised for a short time, achieving a good finish.

■Scattering controlThere is no flux or solder ball scattering, which is a concern due to sudden heating or sudden expansion, and there are no balls.

■WettabilityThe flux has good wetting power after laser irradiation under all conditions, and the flux spreads in a perfect circular shape.

■No burnt fluxBecause this product was developed for laser use, the use of ultra-high temperature heat resistant flux prevents residue from burning.

■Insulation resistance test (85℃ 85%RH 168hr)5.0×10^8 or more (JIS Z3197)

■Migration test (85℃ 85%RH 1,000hr)No abnormality (JIS Z3197)

Model
There is 1 model available for this product.

Product
Laser soldering compatible product Supports localized rapid heating and prevents scattering Laser solder paste FLF01-BM (D)

Handling Company
Matsuo Handa Co., Ltd.

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1 Models of Laser soldering compatible product Supports localized rapid heating and prevents scattering Laser solder paste FLF01-BM (D)

Image	Part Number	Price (excluding tax)	Copper plate corrosion test	Viscosity characteristics (Pa・s)	Liquidus temperature (℃)	Spread rate (%)	Solidus temperature (℃)	Alloy composition (%)	Flux content (%)	Halide content (%)	Thixotropic index	Solder powder size TYPE4/TYPE5 (μm)
	FLF01-BM (D)	Available upon quote	Passed (JIS Z3197)	90 (JIS Z3284)	Approximately 219 (JIS Z3282)	88 (JIS Z3197)	Approximately 217 (JIS Z3282)	Sn96.5-Ag3.0-Cu0.5 (JIS Z3282)	13.00 (JIS Z3197)	0.05 (JIS Z3197)	0.65 (JIS Z3284)	22~38 15~25 (JIS Z3284 J-STD-005)

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About Company Handling This Product

Matsuo Handa Co., Ltd.

Japan

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Laser soldering compatible product Supports localized rapid heating and prevents scattering Laser solder paste FLF01-BM (D) Matsuo Handa Co., Ltd.

About This Product

■Product that suppresses rapid heating and scattering during non-contact laser soldering

■Flux scattering control, good finish

■Excellent wetness

■Good finish

■Scattering control

■Wettability

■No burnt flux

■Insulation resistance test (85℃ 85%RH 168hr)

■Migration test (85℃ 85%RH 1,000hr)

1 Models of Laser soldering compatible product Supports localized rapid heating and prevents scattering Laser solder paste FLF01-BM (D)

FLF01-BM (D)

Other products of Matsuo Handa Co., Ltd.

About Company Handling This Product

Laser soldering compatible product Supports localized rapid heating and prevents scattering Laser solder paste FLF01-BM (D)
Matsuo Handa Co., Ltd.