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Lead-free solder paste Halogen-free type FLF01-LH-FLF01-LH
Lead-free solder paste Halogen-free type FLF01-LH-Matsuo Handa Co., Ltd.

Lead-free solder paste Halogen-free type FLF01-LH
Matsuo Handa Co., Ltd.


About This Product

■Good wetting properties despite being halogen-free

・Halogen-free standard Chlorine (Cl): 900ppm or less. - Bromine (Br): 900ppm or less. ・Chlorine (Cl) and bromine (Br): 1,500ppm or less. ・Although it has high reliability, it has achieved the same good wetability as regular products that are not halogen-free. ・After printing solder paste to a thickness of 120μm on the board, mount the 2010chip parts at 160 to 190℃, preheat for 90 seconds, and observe the wet state after reflow heating at 240℃.

■Excellent heat resistance

・Using our unique activator technology, we have ensured a wide activation temperature range and improved heat resistance. ・Print the solder paste on a brass plate with a diameter of 6.5 mm and a thickness of 200 μm. Preheat at 200℃ for 3 minutes, then reflow heat at 240℃. Observe the melting state.

■Insulation resistance test (85℃ 85%RH 168hr)

1.0×10^9 or more (JIS Z3197)

■Migration test (85℃ 85%RH 1,000hr)

No abnormality (JIS Z3197)

  • Product

    Lead-free solder paste Halogen-free type FLF01-LH

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1 Models of Lead-free solder paste Halogen-free type FLF01-LH

Image Part Number Price (excluding tax) Copper plate corrosion test Viscosity characteristics (Pa・s) Liquidus temperature (℃) Spread rate (%) Solidus temperature (℃) Alloy composition (%) Flux content (%) Halide content (%) Thixotropic index Solder powder size (μm)
Lead-free solder paste Halogen-free type FLF01-LH-Part Number-FLF01-LH

FLF01-LH

Available upon quote

Passed (JIS Z3197)

190

Approximately 219 (JIS Z3282)

87 (JIS Z3197)

Approximately 217 (JIS Z3282)

Sn96.5-Ag3.0-Cu0.5 (JIS Z3282)

11.50 (JIS Z3197)

0.03 (JIS Z3197)

0.54 (JIS Z3284)

20~38 Type4 (JIS Z3284 J-STD-005)

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