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Response Rate
100.0%
Response Time
111.5hours
Product
Lead-free solder paste standard type FLF01ーBZ (L)Handling Company
Matsuo Handa Co., Ltd.Image | Part Number | Price (excluding tax) | Copper plate corrosion test | Viscosity characteristics (Pa・s) | Liquidus temperature (℃) | Spread rate (%) | Solidus temperature (℃) | Alloy composition (%) | Flux content (%) | Halide content (%) | Thixotropic index | Solder powder size (μm) |
---|---|---|---|---|---|---|---|---|---|---|---|---|
FLF01ーBZ (L) |
Available upon quote |
Passed (JIS Z3197) |
190 (JIS Z3284) |
Approximately 219 (JIS Z3282) |
88 (JIS Z3197) |
Approximately 217 (JISZ3282) |
Sn96.5-Ag3.0-Cu0.5 (JIS Z3282) |
11.50 (JIS Z3197) |
0.05 (JIS Z3197) |
0.55 (JIS Z3284) |
20~38 Type4 (JIS Z3284 J-STD-005) |
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Response Rate
100.0%
Response Time
111.5hrs