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IC mounting equipment-IC mounting equipment
IC mounting equipment-OHMIYA IND.CO.,LTD

IC mounting equipment
OHMIYA IND.CO.,LTD

About This Product

This device uses a halogen heater and hot air to solder small surface mount components such as BGA and CSP. This allows for mounting with minimal thermal effects on peripheral components during rework.

■Features

・Small size and energy saving. ・Can handle complex temperature profiles. ・Easy to protect parts that do not want to overheat. ・Also available for double-sided mounting boards with encapsulant. ・We can flexibly handle a wide variety of boards and parts for development and repair. - We have improved the operation to reduce profile selection errors. ・We have a track record of reworking over 500,000 pieces.

  • Product

    IC mounting equipment

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1 Models of IC mounting equipment

Image Part Number Price (excluding tax) Power supply Maximum temperature Heating rate Target part size Target board size Size Main heater Preheater
IC mounting equipment-Part Number-IC mounting equipment

IC mounting equipment

Available upon quote

AC100V50/60Hz4A

Approximately 500℃ (our test board)

0.5℃/sec~maximum 20℃/sec (our test board)

5×5~20×20t<5 (mm)

50×50×1~85×105×5 (mm)

W220×D345×352 (mm)

Halogen lamp maximum output 150W

Hot air type 200W

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About Company Handling This Product

OHMIYA IND.CO.,LTD

Company Overview

OHMIYA IND.CO.LTD, established in 1975 and headquartered in Hiroshima, Japan, is a manufacturer and distributo...

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  • Japan

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Mounters
Mounters　OHMIYA IND.CO.,LTD
OHMIYA IND.CO.,LTD

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