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BGA (CSP) cutting equipment-BGA (CSP) cutting equipment Tabletop installation type standard specification for small boards
BGA (CSP) cutting equipment-OHMIYA IND.CO.,LTD

BGA (CSP) cutting equipment
OHMIYA IND.CO.,LTD


About This Product

BGA (CSP) cutting equipment is a device that reduces heat load and removes surface-mounted ICs such as BGA and CSP by cutting. It is especially effective for removing ICs with underfill.

■Features

- ICs can be removed while minimizing the effects of heat. ・For teaching, simply specify the two diagonal points and depth of the IC (in automatic creation mode) -Easy to create using dedicated software and controller. ・The height is automatically adjusted, so no teaching is required. ・Easy to switch cutting patterns - Positioning and warp correction jig is required for each board.

  • Product

    BGA (CSP) cutting equipment

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1 Models of BGA (CSP) cutting equipment

Image Part Number Price (excluding tax) Weight Parts size Type Target board size Size Cutting time Position accuracy Utilities etc. Spindle rotation speed
BGA (CSP) cutting equipment-Part Number-BGA (CSP) cutting equipment Tabletop installation type standard specification for small boards

BGA (CSP) cutting equipment Tabletop installation type standard specification for small boards

Available upon quote

Approximately 40kg

5mm×5mm~25mm×25mmH<2mm

Standard specifications for desktop installation type for small boards

Maximum 115mm×85mm×t<5mm

W660mm×D460mm×H635mm/excluding dust collector and control PC

Approximately 15 minutes (IC external size: W15mm x D15mm x H1.0mm)

Repeat position accuracy ±20μm

AC100V50/60Hz1,500W (including dust collector) *Varies depending on the dust collector used
Air: Pressure: 0.5MPa, consumption: 155NL/min will fluctuate

Air spindle: 6,000~6,500min^-1 (rotation speed at no load, air pressure 0.5MPa)

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About Company Handling This Product

Company Overview

OHMIYA IND.CO.LTD, established in 1975 and headquartered in Hiroshima, Japan, is a manufacturer and distributo...

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  • Japan

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