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Semi-automatic wafer expander with built-in automatic cutting mechanism OEX-SA-series-OEX-SA 8inch
Semi-automatic wafer expander with built-in automatic cutting mechanism OEX-SA-series-OHMIYA IND.CO.,LTD

Semi-automatic wafer expander with built-in automatic cutting mechanism OEX-SA-series
OHMIYA IND.CO.,LTD


About This Product

The wafer expander is a tabletop type expanding device that allows you to expand, fit grip rings, and cut tape with one touch.

■Applications

Achieves high-definition expansion using motor control. Height can be adjusted in 0.1mm increments and speed can be adjusted in 0.1mm/sec. High-resolution control enables delicate operations such as expansion (chip expansion) and wafer division (braking) after laser dicing. In addition, with the automatic cutting function, you can fit the grip ring, expand it, and cut the extra width tape with just one touch of the start button. It prevents individual differences and human errors caused by manual labor, eliminates unnecessary labor, and can be expected to improve work efficiency.

■Basic operations

Set and lock the grip ring (inner ring, outer ring) and dicing frame. All you have to do is press the start button. If necessary, you can also adjust the temperature of the table heater.

■High-definition expand

Motor drive enables high-definition expansion. Expansion accuracy has also been improved.

■Easy and precise speed and height adjustment

Easily set the expansion stroke and speed using the touch panel. Since each setting is entered digitally on the touch panel, management can be performed numerically. Prevents variations between workers and rods.

■Stage temperature control function

The stage's built-in heater allows temperature control from room temperature to 80℃. Expands tape expandability.

■Compact design

Although it has a compact table-top design, it has a built-in automatic cutting function. It is extremely compact for a semi-automatic machine that can cut with just one touch.

■Full auto compatible

Fully automatic operation is also available upon request. A series of tasks can be further automated.

  • Product

    Semi-automatic wafer expander with built-in automatic cutting mechanism OEX-SA-series

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1 Models of Semi-automatic wafer expander with built-in automatic cutting mechanism OEX-SA-series

Image Part Number Price (excluding tax) Power supply Weight Temperature adjustment Lifting speed Expansion height Compatible sizes Size Air
Semi-automatic wafer expander with built-in automatic cutting mechanism OEX-SA-series-Part Number-OEX-SA 8inch

OEX-SA 8inch

Available upon quote

AC100V50/60Hz10A

Approximately 70kg

Room temperature~80℃

Adjustable in 1~20mm/sec0.1mm/s increments

15mm~55mm stopping accuracy ±0.1mm

8inch dicing frame

W480×D600×H564 (mm)

0.4Mpa or more 10L/min or more

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About Company Handling This Product

Company Overview

OHMIYA IND.CO.LTD, established in 1975 and headquartered in Hiroshima, Japan, is a manufacturer and distributo...

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  • Japan

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