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  4. Fully automatic wafer mounter OTM-FA-series (OHMIYA IND.CO.,LTD)
Fully automatic wafer mounter OTM-FA-series-OTM-FA
Fully automatic wafer mounter OTM-FA-series-OHMIYA IND.CO.,LTD

Fully automatic wafer mounter OTM-FA-series
OHMIYA IND.CO.,LTD

About This Product

A fully automatic wafer mounter is a fully automatic type of device that mounts wafers on a dicing frame (tape frame) before dicing. It automatically performs a series of operations from [wafer removal] from the wafer cassette → [alignment] → [taping to the dicing frame] → [wafer mounting] → [storage to the specified magazine].

■Summary

・In-line cutting within the device ・Supports roll/precut tape ・Easy operation using touch panel ・Application and storage patterns based on a variety of recipe selections ・Vacuum pasting unit can be installed (optional) ・Possible to remove protective tape after wafer mounting (optional) ・Can be equipped with UV irradiation unit for BG protective tape (optional) ・Workpieces other than wafers can also be handled (optional) ・SECS communication compatible (optional)

■Non-contact pasting on pattern surface

It is possible to paste without adsorbing the patterned surface. We propose an attachment method that prevents damage due to adsorption and takes into account delicate wafers such as ultra-thin wafers and MEMS.

■Non-contact alignment for different sizes

The aligners use our unique non-contact method. By performing alignment by suction only on the outer circumference of a few mm, there is no need to worry about suction marks on the product area, particle adhesion, or edge chips caused by edge clamping.

■Pattern surface non-contact handling

Contactless transportation is also possible. It is possible to attach various hands such as a peripheral suction hand or a Bernoulli hand. Even for wafers that are warped or bent, we will verify and propose a transportation method.

■Pasting

We propose a unique attachment method that minimizes tape consumption and reduces the occurrence of scratches on the dicing frame (tape frame) and the generation of metal powder due to contact between the frame and cutter. In addition, with the optional vacuum bonding, it is possible to adhere to wafers with steps or unevenness such as TAIKO wafers, which have been attracting attention in recent years for IGBTs, and to apply low tension to fragile wafers such as MEMS wafers and thin wafers.

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    Fully automatic wafer mounter OTM-FA-series

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1 Models of Fully automatic wafer mounter OTM-FA-series

Image Part Number Price (excluding tax)
Fully automatic wafer mounter OTM-FA-series-Part Number-OTM-FA

OTM-FA

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About Company Handling This Product

OHMIYA IND.CO.,LTD

Company Overview

OHMIYA IND.CO.LTD, established in 1975 and headquartered in Hiroshima, Japan, is a manufacturer and distributo...

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