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  2. Vacuum pasting device OVM-series (OHMIYA IND.CO.,LTD)
Vacuum pasting device OVM-series-OVM 8inch
Vacuum pasting device OVM-series-OHMIYA IND.CO.,LTD

Vacuum pasting device OVM-series
OHMIYA IND.CO.,LTD

About This Product

In recent years, devices such as bumps, MEMS, TAIKO®*1, and backside mounting have increasingly had large steps formed on the front and back sides, and wafer warping due to thinning has become inevitable. With the conventional roller bonding method, problems such as stress on the wafer and residual voids occurred due to uneven pressure during bonding. Our vacuum pasting equipment solves these problems and achieves bubble-free, low-stress pasting. Furthermore, by quantifying various parameters related to pasting, which were difficult to use with past pasting devices, and incorporating them into the recipe, we have created a tool that can suppress variations among workers and perform tension-free and void-free pasting.

■Features

・Realizes low stress attachment - Numerical management of various parameters of pasting conditions (sticking speed, degree of vacuum, differential pressure, air release speed, etc.) ・Execute multiple pasting recipes with one button ・It is also possible to handle different size workpieces by changing the setup. ・Applying tape to workpieces with large steps such as TAIKO®*¹ wafers ・Applying tape to fragile workpieces such as MEMS and ultra-thin wafers that do not require stress during attachment. ・Mass production is also possible by installing the unit on our fully automatic equipment. ・Attachment of film/tape and wafer/substrate (laminating high-performance films such as various protective films and dry films, as wafer mount before dicing) ・Heating and vacuum pasting is possible by using an optional heater. ・By using an optional stage, it is possible to paste without contacting the pattern surface. *¹ TAIKO® is a technology developed by DISCO that grinds and thins only the inner area, leaving the outer periphery of the back surface of the wafer intact.

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    Vacuum pasting device OVM-series

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1 Models of Vacuum pasting device OVM-series

Image Part Number Price (excluding tax) Power supply Weight Adaptive work Vacuum source Compatible tape Size Recipe settings Dry air
Vacuum pasting device OVM-series-Part Number-OVM 8inch

OVM 8inch

Available upon quote

AC200V50/60Hz15A (3-phase)

Approximately 110kg

2inch~8inch wafer/substrate etc.
5inch~8inch dicing frame

Dry pump

Various tapes

W500×D770×H1,010 (mm)
(with adjuster)

Choose from 10 types

0.5Mpa or more 150L/min (ANR)

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About Company Handling This Product

OHMIYA IND.CO.,LTD

Company Overview

OHMIYA IND.CO.LTD, established in 1975 and headquartered in Hiroshima, Japan, is a manufacturer and distributo...

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