Thermal shock device TSD-101-W-TSD−101−W

Thermal shock device TSD-101-W
ESPEC CORP.

ESPEC CORP.'s Response Status

Response Rate

100.0%

Response Time

44.4hours

About This Product

■Elevating 2-zone test area・A two-zone thermal shock device that perfectly fits domestic and international standard tests such as JIS60068-2-14 Na, MIL-STD-883, and JASO-D902.
- Equipped with network instrumentation that allows you to monitor and manage the operating status of test equipment in remote locations from your desk.
・With excellent temperature distribution performance, it applies uniform temperature stress to the sample and can be used in a wide range of fields from research and development to inspection and production fields.

■Temperature distribution performanceIt evenly distributes the air flow within the test area and achieves excellent temperature distribution performance. This applies uniform thermal stress to the sample and minimizes variation in test results between samples.

■Reduction of test timeSince the test area is switched between the high temperature chamber and the low temperature chamber by moving up and down, the set temperature is reached quickly and the test time is shortened.

■Can measure sample temperatureEquipped with a sample temperature trigger that counts the exposure time or immediately moves to the next step after the sample temperature reaches the set value. Achieves shortening of total test time and reliable arrival of sample temperature. It can also be connected to a temperature recorder to record the temperature of the sample and test area.

■＋150℃↔−65℃, temperature recovery time is 5 minutes.The TSD has high performance, allowing the sample to return to temperature within 15 minutes (when the set temperature is +155℃ and -68℃, and the plastic molded IC sample is 10kg). The small type TSE achieves temperature recovery within 5 minutes with two-zone upwind control.

■Test area movement time within 10 secondsCompatible with test standards such as MIL-STD-883 and JISC60068-2-14Na.

■Stable temperature distribution performance Reduces vibration and shockIt evenly distributes the air flow into the test area and has excellent temperature distribution performance. Provides uniform thermal stress to minimize variation in test results between samples.

■Reduce vibration and shockAutomatically switches to soft move mode to reduce vibration and shock to the sample when moving between the high temperature chamber and the low temperature chamber in the test area.

■Protect the sampleTest area Fall prevention mechanism Equipped with a brake mechanism for the drive unit in case the drive stops inside the tank. Prevents samples from falling from the test area.

Model
There is 1 model available for this product.

Product
Thermal shock device TSD-101-W

Handling Company
ESPEC CORP.

Categories

Test Equipment

Impact Testers

Test Equipment

Environmental Testers

Test Equipment

Thermal Cycle Test Chamber

Test Equipment

Thermal Shock Equipment

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1 Models of Thermal shock device TSD-101-W

Image	Part Number	Price (excluding tax)	High temperature exposure temperature range	Noise	Power supply	Operable ambient temperature range	Mass	Sample basket load capacity	Water supply amount	Water supply pressure	Temperature recovery time	Temperature fluctuation	Temperature fall time	Temperature rise time	Conditions	Maximum load current	Method	Exhaust heat amount	Room temperature return time	Foreign law	Compressor	Refrigerant	Cooler	Freezing method	Low temperature exposure temperature range	Preheating upper limit	Precooling lower limit	Test area load capacity	Test area travel time	Test area dimensions	Test area content	Test area
	TSD−101−W	Available upon quote	+60℃~+205℃	65dB or less	AC200V 3φ 3W 50/60Hz (Power supply voltage fluctuation: ±10% of rating)	+5℃~+40℃	Approximately 1,100kg	5kg/1 piece (equally distributed load)	2,050L/h (Reference water temperature + 25℃), 3,400L/h (Reference water temperature + 32℃)	0.2Mpa Gauge~0.5Mpa Gauge (2~5kg/cm2G)	Sample IC temperature within 15 minutes	±1.0℃	Room temperature → −77℃ (Setting: −77℃) Within 90 minutes	Room temperature → +200℃ (Setting: +205℃) within 90 minutes	・High temperature exposure +150℃ to +55℃ or less ・Ambient temperature +23℃ ・Power supply voltage Specified voltage ・Sample Plastic mold IC 10kg	64A	2-zone method by moving the sample up and down	12,600kJ/h (3,000kcal/h)	Within 90 minutes	W1,100×H1,885×D1,965mm	Scroll type 3.73kW (5HP) 2 units	R-23, R-404A [Can be changed to low GWP refrigerant R-449A]	Plate fin cooler, regenerator	Mechanical dual refrigeration system (water-cooled condenser)	-77℃~0℃	+205℃	-77℃	30kg (when using test area floor and heavy object sample shelf (optional))	Within 10 seconds (high temperature incubator ⇔ low temperature incubator)	W710×H345×D410mm	100L	2 tier shelf supports (4 tiers can be installed)

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About Company Handling This Product

ESPEC CORP.

Response Rate

100.0%

Response Time

44.4hrs

Company Overview

ESPEC CORP., founded in 1947 and based in Osaka, Japan, is a manufacturer of environmental test chambers, list...

Japan

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Thermal shock device TSD-101-W ESPEC CORP.

ESPEC CORP.'s Response Status

About This Product

■Elevating 2-zone test area

■Temperature distribution performance

■Reduction of test time

■Can measure sample temperature

■＋150℃↔−65℃, temperature recovery time is 5 minutes.

■Test area movement time within 10 seconds

■Stable temperature distribution performance Reduces vibration and shock

■Reduce vibration and shock

■Protect the sample

1 Models of Thermal shock device TSD-101-W

TSD−101−W

Customers who viewed this product also viewed

Other products of ESPEC CORP.

About Company Handling This Product

Related search keywords

Thermal shock device TSD-101-W
ESPEC CORP.