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Compact High Power SMD EDCC Family (Surface mount type high power small package)-EDCC Family
Compact High Power SMD EDCC Family (Surface mount type high power small package)-Ushio Inc.

Compact High Power SMD EDCC Family (Surface mount type high power small package)
Ushio Inc.


About This Product

■Product overview

This is a package equipped with a high-power LED chip and has a small size similar to CSP (Chip Sized Package). It is a compact surface-mounted LED that can be arranged freely by arranging multiple wavelengths or mounting at high density.

■Features

・Uses high-power LED chips with a rich lineup of wavelengths such as UV, visible light, IR, and SWIR, which are used in the SMBB family and EDC family. ・SMD type LED that is close to CSP and has a small package size comparable to a high-power LED chip, making it easy to arrange it as you like. ・Package design optimized for high-density mounting ・A rich and diverse product lineup

■Application

The following applications require high brightness, high output, and a combination of multiple wavelengths. ・Machine vision ・Optical sorting ・Plant cultivation ・Security ・Surveillance camera ・Optical authentication ・Inspection equipment ・Vital sensing etc.

  • Product

    Compact High Power SMD EDCC Family (Surface mount type high power small package)

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1 Models of Compact High Power SMD EDCC Family (Surface mount type high power small package)

Image Part Number Price (excluding tax) Minimum order quantity Package Chip size
Compact High Power SMD EDCC Family (Surface mount type high power small package)-Part Number-EDCC Family

EDCC Family

Available upon quote

MOQ: 1,000

High power compact package with chip size of 1.5mm x 1.85mm. Ideal for high-density mounting.

1mm or more

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About Company Handling This Product

Company Overview

Ushio Inc., established in 1964 in Tokyo, Japan, is a manufacturer and supplier of specialized light sources, ...

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  • Japan

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