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  4. Printed circuit board Resin-filled board (Pad on Via) (Ihara Electronics Industry Co., Ltd.)
Printed circuit board Resin-filled board (Pad on Via)-Pad on Via
Printed circuit board Resin-filled board (Pad on Via)-Ihara Electronics Industry Co., Ltd.

Printed circuit board Resin-filled board (Pad on Via)
Ihara Electronics Industry Co., Ltd.

Ihara Electronics Industry Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

39.4hours

About This Product

Wiring space can be saved by filling the through-hole with a special resin or metal paste and then plating a lid on top to provide a pad. It is used when VIA cannot be placed between pads such as narrow pitch BGA.

  • Product

    Printed circuit board Resin-filled board (Pad on Via)

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1 Models of Printed circuit board Resin-filled board (Pad on Via)

Image Part Number Price (excluding tax)
Printed circuit board Resin-filled board (Pad on Via)-Part Number-Pad on Via

Pad on Via

Available upon quote

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About Company Handling This Product

Ihara Electronics Industry Co., Ltd.

Response Rate

100.0%

Response Time

39.4hrs

  • Japan

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Printed Circuit Boards
Printed Circuit Boards　Ihara Electronics Industry Co., Ltd.
Ihara Electronics Industry Co., Ltd.

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