All Categories
History
Response Rate
100.0%
Response Time
144.8hours
Product
Peltron (conductive material) <Various conductive materials> Conductive adhesive XJS-3060-1Handling Company
PelnoxCategories
Image | Part Number | Price (excluding tax) | Characteristics after curing Curing conditions | Characteristics after curing Volume resistivity value | Properties after curing Die shear strength | Properties before curing Viscosity | Characteristics before curing Appearance | Pre-curing properties Storage conditions | Properties before curing Binder | Characteristics before curing Gel time | Purpose | Function | Category |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
XJS-3060-1 |
Available upon quote |
Hot air drying oven: 150℃ x 2 minutes |
150℃×2 minutes curing: 5.0×10^-3 (Ω・cm) |
Si chip/Al2O3 substrate: 35N/mm2 |
E-type viscometer / 5rpm / 25℃: 5~20Pa・s |
Visual: silvery yellow |
Unopened/Frozen (-15℃ or below): 2 months |
Epoxy resin type |
On 145℃ hot plate: 8 seconds |
Semiconductor module Automotive electrical components General module Die attach Solar cell |
One-component fast curing |
Conductive adhesive |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.