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Response Time
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Product
Peltron (conductive material) <Various conductive materials> Conductive adhesive XJS-3050Handling Company
PelnoxCategories
Image | Part Number | Price (excluding tax) | Product form | Cured product properties Recommended curing conditions | Cured product properties Volume resistance value | Cured product properties Shear adhesive strength @25℃ | Curing conditions | Purpose | Liquid properties Viscosity | Liquid properties Storage stability | Function | Category |
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XJS-3050 |
Available upon quote |
Pot, syringe |
Hot air drying oven: 100℃ x 60 minutes |
100℃ x 60 minutes Curing: 4.5 x 10^‒4 (Ω・cm) |
・4mm2 Si chip/Cu plating surface: 22N/mm2 |
100℃ 60 minutes |
Semiconductor module Automotive electrical components General module Die attach Solar cell |
B type viscometer / 10rpm / @25℃: 60Pa・s |
Unopened/Frozen (-15℃ or less): 2 months |
One-component low temperature curing |
Conductive adhesive |
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Reviews shown here are reviews of companies.